Package Mechanical Specifications

3.2Processor Component Keep-Out Zones

The processor may contain components on the substrate that define component keep-out zone requirements. A thermal and mechanical solution design must not intrude into the required keep- out zones. Decoupling capacitors are typically mounted to either the topside or land-side of the package substrate. See Figure 3-2and Figure 3-3for keep-out zones.

The location and quantity of package capacitors may change due to manufacturing efficiencies but will remain within the component keep-in.

3.3Package Loading Specifications

Table 3-1provides dynamic and static load specifications for the processor package. These mechanical maximum load limits should not be exceeded during heatsink assembly, shipping conditions, or standard use condition. Also, any mechanical system or component testing should not exceed the maximum limits. The processor package substrate should not be used as a mechanical reference or load-bearing surface for thermal and mechanical solution. The minimum loading specification must be maintained by any thermal and mechanical solutions.

.

Table 3-1. Processor Loading Specifications

Parameter

Minimum

Maximum

Notes

 

 

 

 

 

Static

80 N [18 lbf]

311 N [70 lbf]

1, 2,

3

 

 

 

 

 

Dynamic

756 N [170 lbf]

1, 3,

4

 

 

 

 

 

NOTES:

1.These specifications apply to uniform compressive loading in a direction normal to the processor IHS.

2.This is the maximum force that can be applied by a heatsink retention clip. The clip must also provide the minimum spec- ified load on the processor package.

3.These specifications are based on limited testing for design characterization. Loading limits are for the package only and does not include the limits of the processor socket.

4.Dynamic loading is defined as the sum of the load on the package from a 1 lb heatsink mass accelerating through a 11 ms trapezoidal pulse of 50 g and the maximum static load.

3.4Package Handling Guidelines

Table 3-2includes a list of guidelines on package handling in terms of recommended maximum loading on the processor IHS relative to a fixed substrate. These package handling loads may be experienced during heatsink removal.

Table 3-2. Package Handling Guidelines

Parameter

Maximum Recommended

Notes

 

 

 

 

Shear

311 N [70 lbf]

1,

4

 

 

 

 

Tensile

111 N [25 lbf]

2,

4

 

 

 

 

Torque

3.95 N-m [35 lbf-in]

3,

4

 

 

 

 

NOTES:

1.A shear load is defined as a load applied to the IHS in a direction parallel to the IHS top surface.

2.A tensile load is defined as a pulling load applied to the IHS in a direction normal to the IHS surface.

3.A torque load is defined as a twisting load applied to the IHS in an axis of rotation normal to the IHS top surface.

4.These guidelines are based on limited testing for design characterization.

Datasheet

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Intel 830 manual Processor Component Keep-Out Zones, Package Loading Specifications, Package Handling Guidelines

830 specifications

The Intel 830 chipset, introduced in the early 2000s, marked a significant evolution in Intel's chipset architecture for desktop and mobile computing. Known for its support of the Pentium 4 processors, the 830 chipset was tailored for both performance and stability, making it an appealing choice for OEMs and enthusiasts alike.

One of the standout features of the Intel 830 chipset is its support for DDR SDRAM, providing a much-needed boost in memory bandwidth compared to its predecessors. With dual-channel memory support, the chipset could utilize two memory modules simultaneously, which effectively doubled the data transfer rate and enhanced overall system performance. This made the Intel 830 particularly beneficial for applications requiring high memory throughput, such as multimedia processing and gaming.

Another important characteristic of the Intel 830 was its integrated graphics support, featuring Intel's Extreme Graphics technology. This integration allowed for decent graphics performance without the need for a dedicated GPU, making it suitable for budget systems and everyday computing tasks. However, for power users and gaming enthusiasts, the option to incorporate a discrete graphics card remained available through the provided PCI Express x16 slot.

The Intel 830 chipset also boasted advanced I/O capabilities, including support for USB 2.0, which provided faster data transfer rates compared to USB 1.1, and enhanced IDE interfaces for connecting hard drives and optical devices. With its Hyper-Threading technology support, the chipset allowed for improved multitasking efficiency, enabling a single processor to execute multiple threads simultaneously, a feature that was particularly beneficial in server environments and complex computing tasks.

In terms of connectivity, the Intel 830 supported multiple bus interfaces, including PCI Express and AGP, thereby enabling users to expand their systems with various add-on cards. This flexibility contributed to the chipset's longevity in the marketplace, as it catered to a wide range of user needs from light computing to intensive gaming and content creation.

In summary, the Intel 830 chipset combined enhanced memory capabilities, integrated graphics performance, robust I/O features, and flexible expansion options, making it a versatile choice for various computing environments during its time. It played a key role in shaping the landscape of early 2000s computing, paving the way for future advancements in chipset technology. Its legacy continues to influence modern computing architectures, illustrating the lasting impact of Intel’s innovative design principles.