SDX-1100V series Ver.1.0 Table of Contents
1. INTRODUCTION.............................................................................................1-1
1.1. About this Product Specification Manual................................................................1-1
1.2. Introducing the Sony AIT Technology..................................................................... 1-1
1.3. Features of the Drive.................................................................................................1-1
1.4. Reference................................................................................................................... 1-3
1.4.1. How to get ECMA-329 Standard Document............................................................ 1-3
2. SPECIFICATIONS.......................................................................................... 2-1
2.1. Specifications............................................................................................................ 2-1
2.1.1. Dimensions.............................................................................................................. 2-1
2.1.1.1. Mounting Holes....................................................................................................... 2-2
2.1.2. Weight..................................................................................................................... 2-4
2.1.3. Connectors.............................................................................................................. 2-4
2.1.3.1. SCSI Cables and Terminators.................................................................................2-4
2.2. Environmental Specifications.................................................................................. 2-4
2.2.1. Temperature and Humidity Range........................................................................... 2-4
2.2.2. Altitude..................................................................................................................... 2-5
2.2.3. Suspended Particulate.............................................................................................2-5
2.2.4. Vibration.................................................................................................................. 2-5
2.2.5. Shock.......................................................................................................................2-5
2.2.6. Acoustic Noise......................................................................................................... 2-5
2.2.7. EMC.........................................................................................................................2-5
2.2.8. Orientation............................................................................................................... 2-5
2.3. Performance Specification....................................................................................... 2-6
2.3.1. Data Capacity.......................................................................................................... 2-6
2.3.2. Data transfer Rate................................................................................................... 2-7
2.3.2.1. Sustained Data Transfer Rate to and from the Tape...............................................2-7
2.3.2.2. Burst Transfer Rate to and from the SCSI Bus....................................................... 2-7
2.3.3. Initialize Time........................................................................................................... 2-7
2.3.4. Load Time................................................................................................................2-7
2.3.5. Unload Time............................................................................................................ 2-7
2.3.6. Search Time............................................................................................................ 2-7
2.3.7. Rewind Time............................................................................................................ 2-7
2.3.8. Long Erase Time..................................................................................................... 2-8
2.3.9. Error Rate................................................................................................................ 2-8
2.3.10. Definition of Failure............................................................................................... 2-8
2.3.11. Mean Time Between Failures................................................................................2-8
2.3.12. Mean Time to Repair............................................................................................. 2-8
2.3.13. Component Life..................................................................................................... 2-8
2.3.14. Durability............................................................................................................... 2-8
2.4. Safety.........................................................................................................................2-9
2.4.1. Conditions of Acceptability....................................................................................... 2-9
2.5. Installation Requirements ........................................................................................ 2-9
2.5.1. Power Requirements............................................................................................... 2-9
2.6. Data Compression...................................................................................................2-10