Intel 41110 manual Package Information, Bridge Package Dimensions Side View

Package Information
Figure 6.	41110 Bridge Package Dimensions (Side View)
	Substrate	0.84±0.05 mm
	2.445±0.102 mm	Decoup	Die
	2.010±0.099 mm	Cap		0.7 mmMax	0.20 See Note 4.
					0.20 -C-
	0.435±0.025 mm		Seating Plane
	See Note 3				See Note 1

Notes:

1.Primary datum-C- and seating plan are defined by the spherical crowns of the solder balls(shown before motherboard attach).

2.All dimensions and tolerances conformto ANSI Y14.5M-1994

3.BGAhas a pre-SMT height of 0.5 mmand post-SMTheight of 0.41-0.46 mm

4.Shown before motherboard attach; FCBGA has a convex (dome shape) orientation before reflowand is expected to have a slightly concave (bowl shaped) orientation after reflow.

Note: Primary datum -C- and seating plane are defined by the spherical crowns of the solder balls.

Note: All dimensions and tolerances conform to ANSI Y14.5M-1982

16 Intel® 41110 Serial to Parallel PCI Bridge Design Guide