Intel 41110 Package Information Figure 6. 41110 Bridge Package Dimensions (Side View)

16 Intel® 41110 Serial to Parallel PCI Bridge Design Guide
Package Information
Figure 6. 41110 Bridge Package Dimensions (Side View)
Note: Primary datum -C- and seating plane are defined by the spherical crowns of the solder balls.
Note: All dimensions and tolerances c onform to ANSI Y14.5M-1982
0.20
0.20 -C-
2.445±0.102 mm
2.010±0.099 mm
0.84±0.05 mm
0.435±0.025 mm
See Note 3
Seating Plane
0.7 mm Max
See No te 1
Substrate
Decoup
Cap See Note 4.
Notes:
1. Primary datum -C-and seati ng plan are defined by the spherical crowns of the solder ball s (shown before motherboard attach).
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5 mm and post-SMT height of 0.41-0.46 mm
4. Shown before motherboard attach; FCBGA has a convex (dome shape) orientation before reflow and is expected to have a slightly
concave (bowl shaped) orientation after refl ow.
Die