General Routing Guidelines
Figure 10. Crosstalk Effects on Trace Distance and Height
H
|
|
|
| P |
|
| Reduce Crosstalk: | |
|
|
|
|
|
| |||
|
|
|
|
|
| |||
|
|
|
|
|
|
|
| - Maximize P |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
aggressor |
| victim | - Minimize H | |||||
|
|
|
|
|
|
| Reference Plane |
•Avoid slots in the ground plane. Slots increases mutual inductance thus increasing crosstalk.
•Make sure that ground plane surrounding connector pin fields are not completely cleared out. When this area is completely cleared out, around the connector pins, all the return current must flow together around the pin field increasing crosstalk. The preferred method of laying out a connector in the GND layer is shown in Figure 11.
Figure 11. PCB Ground Layout Around Connectors
Connector
Connector Pins
GND PCB Layer
A. Incorrect method | B. Correct method |
6.3EMI Considerations
It is highly recommended that good EMI design practices be followed when designing with the 41110.
•To minimize EMI on your PCB a useful technique is to not extend the power planes to the edge of the board.
•Another technique is to surround the perimeter of your PCB layers with a GND trace. This helps to shield the PCB with grounds minimizing radiation.
The below link can provide some useful general EMI guidelines considerations:
http://developer.intel.com/design/auto/mcs96/applnots/272673.htm
24 | Intel® 41110 Serial to Parallel PCI Bridge Design Guide |