Intel 41110 manual About This Document, Terminology and Definitions Sheet 2

About This Document

Table 1. Terminology and Definitions (Sheet 2 of 2)

Term						Definition
					Layer 1: copper		Printed circuit board.
							Example manufacturing process consists of
					Prepreg		the following steps:
					Layer 2: GND
								• Consists of alternating layers of core and
					Core			prepreg stacked
PCB					Layer 3: VCC15			• The finished PCB is heated and cured.
								• The via holes are drilled
					Prepreg
					Layer 4: copper			• Plating covers holes and outer surfaces
								• Etching removes unwanted copper
		Example of a Four-Layer Stack						• Board is tinned, coated with solder mask
								and silk screened
SSTL_2	Series Stub Terminated Logic for 2.5 V
JEDEC	Provides standards for the semiconductor industry.
	A network that transmits a coupled signal to another network is aggressor network.
				Zo
Aggressor		Zo						Zo
									Zo
					Victim Network
			Aggressor Network
Victim	A network that receives a coupled cross-talk signal from another network is a victim network.
Network	The trace of a PCB that completes an electrical connection between two or more components.
Stub	Branch from a trunk terminating at the pad of an agent.
CRB	Customer Reference Board
	Downstream refers either to the relative position of an interconnect/system element (Link/
Downstream	device) as something that is farther from the Root Complex, or to a direction of information
	flow, i.e., when information is flowing away from the Root Complex.
Upstream
Local memory	Memory subsystem on the Intel XScale® processor DDR SDRAM or Peripheral Bus Interface
	busses.
DWORD	32-bit data word.
	FC-BGA (flip chip-ball grid array) chip packages are designed with processor core flipped up
Flip Chip	on the back of the chip, facing away from the PCB. This allows more efficient cooling of the
	package.
Mode	Mode Conversions are due to imperfections on the interconnect which transform differential
Conversion	mode voltage to common mode voltage and common mode voltage to differential voltage.
PCI-E	PCI-Express

8 Intel® 41110 Serial to Parallel PCI Bridge Design Guide