Datasheet 3
Contents
1 Introduction....................................................................................................................... 11
1.1 Overview... .......................................................................................................... 11
1.2 Processor Abstraction Layer............................ ... ... ... ... .......................................11
1.3 Mixing Processors of Different Frequencies and Cache Sizes ...........................12
1.4 Terminology......................................................................................................... 12
1.5 State of Data .......................................................................................................12
1.6 Reference Documents......................................................................................... 13
2 Electrical Specifications.................................................................................................... 15
2.1 Itanium® 2 Processor System Bus................................... ...................................15
2.1.1 System Bus Power Pins................................................... ......................15
2.1.2 System Bus No Connect........................... ... ... .... ... ... ... .... ... ... ... ... .... ... ... 15
2.2 System Bus Signals ............................................................................................15
2.2.1 Signal Groups......................................................................................... 15
2.2.2 Signal Descriptions................................................................................. 16
2.3 Package Specifications.......................... .............................................................17
2.4 Signal Specifications.............................. ... ... .... ... ... ... ... .......................................18
2.4.1 Maximum Ratings................................................................................... 22
2.5 System Bus Signal Quality Specifications and Measurement Guidelines...........23
2.5.1 Overshoot/Undershoot Magnitude .........................................................23
2.5.2 Overshoot/Undershoot Pulse Duration...................................................24
2.5.3 Activity Factor...................................................................................... ...24
2.5.4 Reading Overshoot/Undershoot Specification Tables............................25
2.5.5 Determining if a System Meets the Overshoot/Undershoot
Specifications..................... .................................................................... 25
2.5.6 Wired-OR Signals................................................................................... 28
2.6 Power Pod Connector Signals ............................................................................30
2.7 Itanium® 2 Processor System Bus Clock and Processor Clocking.. ...................32
2.8 Recommended Connections for Unused Pins ....................................................35
3 Pinout Specifications.............................................................. ..........................................37
4 Mechanical Specifications................................................................................ ................69
4.1 Mechanical Dimensions ......................................................................................69
4.2 Package Marking................................................................................................. 72
4.2.1 Processor Top-Side Marking.................................................................. 72
4.2.2 Processor Bottom-Side Marking............................................................. 72
5 Thermal Specifications........................................................................ ... .... ......................75
5.1 Thermal Features...................................................................... .... ......................75
5.1.1 Thermal Alert.......................................................................................... 75
5.1.2 Enhanced Thermal Management........................................................... 76
5.1.3 Thermal Trip........................................................... ... ... .... ... ... ... ... .... ... ... 76
5.2 Case Temperature . ... ... ... ... .... ... ..........................................................................76
6 System Management Feature Specifications................................................................... 79
6.1 System Management Bus......................... ..........................................................79
6.1.1 System Management Bus Interface............. ..........................................79
6.1.2 System Management Interface Signals..................................................79