Datasheet 7
6-2 Thermal Sensing Device SMBus Addressing on the Itanium® 2 Processor .......81
6-3 EEPROM SMBus Addressing on the Itanium® 2 Processor............................... 82
6-4 Processor Information ROM Format ...................................................................82
6-5 Current Address Read SMBus Packet................................................... .............86
6-6 Random Address Read SMBus Packet ..............................................................86
6-7 Byte Write SMBus Packet................................ ...................................................86
6-8 Write Byte SMBus Packet................... ................................................................87
6-9 Read Byte SMBus Packet................................................... ................................87
6-10 Send Byte SMBus Packet......................... ..........................................................87
6-11 Receive Byte SMBus Packet............................................................................... 87
6-12 ARA SMBus Packet ............................................................................................ 87
6-13 Command Byte Bit Assignment........................................................................... 88
6-14 Thermal Sensing Device Status Register............................................................89
6-15 Thermal Sensing Device Configuration Register ................................................89
6-16 Thermal Sensing Device Conversion Rate Register........................................... 90
A-1 Address Space Size............................................................................................ 92
A-2 Effective Memory Type Signal Encoding.............................................................92
A-3 Special Transaction Encoding on Byte Enables..................................................93
A-5 BR0# (I/O), BR1#, BR2#, BR3# Signals for 2P Rotating Interconnect................95
A-4 BR0# (I/O), BR1#, BR2#, BR3# Signals for 4P Rotating Interconnect................95
A-6 BR[3:0]# Signals and Agent IDs..........................................................................95
A-7 DID[9:0]# Encoding.......................................................................... ...................97
A-8 Extended Function Signals..................................................................................99
A-9 Length of Data Transfers...................................................................................100
A-10 Transaction Types Defined by REQa#/REQb# Signals.................................... 102
A-11 STBp[7:0]# and STBn[7:0]# Associations......................................................... 104
A-12 Output Signals...................................................................................................105
A-13 Input Signals......................................................................................................106
A-14 Input/Output Signals (Single Driver)..................................................................107
A-15 Input/Output Signals (Multiple Driver).............................................................. .107