Mechanical Specifications
Figure 4-2. Itanium® 2 Processor Package
90.00
42.50
38.50
48.26
42.50
38.50
Top View
IHS Height (See Note)
Substrate Height (See Note)
1.43
0.00
2.03
Integrated Heat Spreader
Processor Package Substrate
Interposer
Side View | Pins |
|
28 x 1.27 Pitch
34.29
25 x 1.27 Pitch
611 x Ø 0.305 Pins
30.48
Bottom View
All dimensions are measured in mm. Not to scale.
000655g
NOTE:
Processor | IHS | Substrate | Units | |
Height | Height | |||
|
| |||
|
|
|
| |
900 MHz (1.5 MB) | 5.575 | 3.397 | mm | |
|
|
|
| |
1.0 GHz (3 MB) | 5.575 | 3.397 | mm | |
|
|
|
| |
1.3 GHz (3 MB) | 5.825 | 3.447 | mm | |
|
|
|
| |
1.4 GHz (4 MB) | 5.825 | 3.447 | mm | |
|
|
|
| |
1.5 GHz (4 MB/6 MB) | 5.825 | 3.447 | mm | |
|
|
|
| |
1.6 GHz (6 MB/9 MB) | 5.825 | 3.447 | mm | |
|
|
|
| |
1.66 GHz (6 MB/9 MB) | 5.825 | 3.447 | mm | |
|
|
|
|
70 | Datasheet |