Texas Instruments MSP430x11x1 Flash memory, interrupt and security key violation, Lock, Emex

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MSP430x11x1

MIXED SIGNAL MICROCONTROLLER

SLAS241C ± SEPTEMBER 1999 ± REVISED JUNE 2000

flash memory control register FCTL3 (continued)

LOCK

012Ch, bit4,

The lock bit may be set during any write, segment-erase, or mass-erase request.

 

 

Any active sequence in progress is completed normally. In segment-write mode,

 

 

the SEGWRT bit is reset and the WAIT bit is set after the mode ends. The lock

 

 

bit is controlled by software or hardware. If an access violation occurs and the

 

 

ACCVIFG is set, the LOCK bit is set automatically.

 

 

0: Flash memory may be read, programmed, erased, or mass erased.

 

 

1: Flash memory may be read but not programmed, erased, or mass erased.

 

 

A current program, erase, or mass-erase operation will complete normally.

 

 

The access-violation interrupt flag ACCVIFG is set when data are written to

 

 

the flash memory module while the lock bit is set.

EMEX,

012Ch, bit5,

Emergency exit. The emergency exit should only be used if the flash memory

 

 

write or erase operation is out of control.

 

 

0: No function.

 

 

1: Stops the active operation immediately, and shuts down all internal parts in

 

 

the flash memory controller. Current consumption immediately drops back

 

 

to the active mode. All bits in control register FCTL1 are reset. Since the

 

 

EMEX bit is automatically reset by hardware, the software always reads

 

 

EMEX as 0.

flash memory, interrupt and security key violation

One NMI vector is used for three NMI events: RST/NMI (NMIIFG), oscillator fault (OFIFG), and flash-memory access violation (ACCVIFG). The software can determine the source of the interrupt request since all flags remain set until they are reset by software. The enable flag(s) should be set simultaneously with one instruction before the return-from-interrupt RETI instruction. This ensures that the stack remains under control. A pending NMI interrupt request will not increase stack demand unnecessarily.

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Contents Description MSP430x11x1Tssop Functional block diagram Available Options Packaged DevicesPIN Sowb PIN Tssop Pulldown resistor of 30 k Ω is needed on F11x1Terminal Functions Short-form descriptionProcessing unit Terminal Description NameAddress Mode Descriptions CPUInstruction set Instruction Word FormatsLow-power consumption capabilities Operation modes and interruptsStatus register R2 SCG1SCG0 SCG1 SCG0Interrupt vector addresses CaifgWdtifg CCIFG1, CCIFG2, TaifgSpecial function registers WdtifgOfifg NmiifgFunctions of the bootstrap loader Boot ROM containing bootstrap loaderMemory organization Features of the bootstrap loader are Hardware resources used for serial input/outputWDT VCC RST/NMI PIN Test PINBootstrap loader Starts VCCTest InternalFlash memory Flash memory control register FCTL1Erase 0128h, bit1, Erase a segment Flash memory, timing generator, control register FCTL2WRT Flash memory control register FCTL3 FN0±FN5SSEL0, SSEL1 AclkBusy KeyvAccvifg WaitLock Flash memory, interrupt and security key violationEmex Accv PUCPOR NmirsPeripherals Oscillator and system clockClock Signals Digital I/OWatchdog timer TimerA Three capture/compare registersTimerA 3 capture/compare registers TimerA, MSP430x11x1 ConfigurationComparatorA Caout CAFCACTL2.4 CATCTL2.7Slope a/d conversion CACTL1Caex Caon Caies Caifg Rsel REF1 REF0 CACTL2Peripherals with Byte Access Peripherals with Word AccessPeripheral file map Recommended operating conditions Absolute maximum ratings²MIN NOM MAX Units MSP430x11x1 Devices Frequency vs Supply VoltageParameter Test Conditions MIN TYP MAX Unit IAMILPM2 ILPM3Outputs Port 1 to P2 P1.0 to P1.7, P2.0 to P2.5 Leakage currentInternal signals TAx, Smclk at TimerA Inputs Px.x, TAxParameter Test Conditions VCC MIN TYP MAX Unit Port P1, P2 P1.x to P2.xOutputs P1.x, P2.x, TAx ComparatorA see NoteVRefVT vs Temperature, VCC = 3 V, C1121 VRefVT vs Temperature, VCC = 2.2 V, C1121PUC/POR CAF CaonRAM Parameter MIN NOM MAX UnitDCO Variance MaxDcoclk DCO StepsWake-up from lower power modes LPMx Principle characteristics of the DCOJTAG/programming Port P1, P1.0 to P1.3, input/output with Schmitt-trigger Input/output schematicGND P1DIR.4 P1OUT.4 Smclk P1IFG.4 P1IES.4P1DIR.5 P1OUT.5 P1IFG.5 P1IES.5Port P2, P2.0 to P2.2, input/output with Schmitt-trigger CAPD.XPort P2, P2.3 to P2.4, input/output with Schmitt-trigger P2DIR.3 P2OUT.3P2IFG.3 P1IES.3 P2DIR.4 P2OUT.4P2SEL.5 VCC P2DIR.5P2OUT.5 P2IRQ.5Port P2, unbonded bits P2.6 and P2.7 Pins DIM MAX DW R-PDSO-GPlastic SMALL-OUTLINE Package PIN ShownPins Shown Pins DIM MAX MINPW R-PDSO-G Plastic SMALL-OUTLINE Package 15 NOM Gage Plane Seating Plane 20 MAXImportant Notice