Texas Instruments MSP430x11x1 Operation modes and interrupts, Low-power consumption capabilities

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MSP430x11x1

MIXED SIGNAL MICROCONTROLLER

SLAS241C ± SEPTEMBER 1999 ± REVISED JUNE 2000

instruction set (continued)

Computed branches (BR) and subroutine calls (CALL) instructions use the same addressing modes as the other instructions. These addressing modes provide indirect addressing, ideally suited for computed branches and calls. The full use of this programming capability permits a program structure different from conventional 8- and 16-bit controllers. For example, numerous routines can easily be designed to deal with pointers and stacks instead of using flag type programs for flow control.

operation modes and interrupts

The MSP430 operating modes support various advanced requirements for ultralow-power and ultralow energy consumption. This is achieved by the intelligent management of the operations during the different module operation modes and CPU states. The advanced requirements are fully supported during interrupt event handling. An interrupt event awakens the system from each of the various operating modes and returns with the RETI instruction to the mode that was selected before the interrupt event. The different requirements of the CPU and modules, which are driven by system cost and current consumption objectives, necessitate the use of different clock signals:

DAuxiliary clock ACLK (from LFXT1CLK/crystal's frequency), used by the peripheral modules

DMain system clock MCLK, used by the CPU and system

DSubsystem clock SMCLK, used by the peripheral modules

low-power consumption capabilities

The various operating modes are controlled by the software through controlling the operation of the internal clock system. This clock system provides many combinations of hardware and software capabilities to run the application with the lowest power consumption and with optimized system costs:

DUse the internal clock (DCO) generator without any external components.

DSelect an external crystal or ceramic resonator for lowest frequency or cost.

DSelect and activate the proper clock signals (LFXT1CLK and/or DCOCLK) and clock pre-divider function.

DApply an external clock source.

Four of the control bits that influence the operation of the clock system and support fast turnon from low power operating modes are located in the status register SR. The four bits that control the CPU and the system clock generator are SCG1, SCG0, OscOff, and CPUOff:

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Contents Tssop MSP430x11x1Description Available Options Packaged Devices Functional block diagramPIN Sowb PIN Tssop Pulldown resistor of 30 k Ω is needed on F11x1Short-form description Terminal FunctionsProcessing unit Terminal Description NameCPU Address Mode DescriptionsInstruction set Instruction Word FormatsOperation modes and interrupts Low-power consumption capabilitiesSCG1 Status register R2SCG0 SCG1 SCG0Caifg Interrupt vector addressesWdtifg CCIFG1, CCIFG2, TaifgWdtifg Special function registersOfifg NmiifgMemory organization Boot ROM containing bootstrap loaderFunctions of the bootstrap loader Hardware resources used for serial input/output Features of the bootstrap loader areWDT VCC RST/NMI PIN Test PINVCC Bootstrap loader StartsTest InternalFlash memory control register FCTL1 Flash memoryWRT Flash memory, timing generator, control register FCTL2Erase 0128h, bit1, Erase a segment FN0±FN5 Flash memory control register FCTL3SSEL0, SSEL1 AclkKeyv BusyAccvifg WaitEmex Flash memory, interrupt and security key violationLock PUC AccvPOR NmirsOscillator and system clock PeripheralsDigital I/O Clock SignalsTimerA Three capture/compare registers Watchdog timerTimerA, MSP430x11x1 Configuration TimerA 3 capture/compare registersComparatorA CAF CaoutCACTL2.4 CATCTL2.7CACTL1 Slope a/d conversionCaex Caon Caies Caifg Rsel REF1 REF0 CACTL2Peripheral file map Peripherals with Word AccessPeripherals with Byte Access MIN NOM MAX Units Absolute maximum ratings²Recommended operating conditions Frequency vs Supply Voltage MSP430x11x1 DevicesIAM Parameter Test Conditions MIN TYP MAX UnitILPM2 ILPM3Leakage current Outputs Port 1 to P2 P1.0 to P1.7, P2.0 to P2.5Inputs Px.x, TAx Internal signals TAx, Smclk at TimerAParameter Test Conditions VCC MIN TYP MAX Unit Port P1, P2 P1.x to P2.xComparatorA see Note Outputs P1.x, P2.x, TAxVRefVT vs Temperature, VCC = 2.2 V, C1121 VRefVT vs Temperature, VCC = 3 V, C1121CAF Caon PUC/PORParameter MIN NOM MAX Unit RAMVariance Max DCODcoclk DCO StepsJTAG/programming Principle characteristics of the DCOWake-up from lower power modes LPMx GND Input/output schematicPort P1, P1.0 to P1.3, input/output with Schmitt-trigger P1IFG.4 P1IES.4 P1DIR.4 P1OUT.4 SmclkP1DIR.5 P1OUT.5 P1IFG.5 P1IES.5CAPD.X Port P2, P2.0 to P2.2, input/output with Schmitt-triggerP2DIR.3 P2OUT.3 Port P2, P2.3 to P2.4, input/output with Schmitt-triggerP2IFG.3 P1IES.3 P2DIR.4 P2OUT.4P2DIR.5 P2SEL.5 VCCP2OUT.5 P2IRQ.5Port P2, unbonded bits P2.6 and P2.7 DW R-PDSO-G Pins DIM MAXPlastic SMALL-OUTLINE Package PIN ShownPins DIM MAX MIN Pins ShownPW R-PDSO-G Plastic SMALL-OUTLINE Package 15 NOM Gage Plane Seating Plane 20 MAXImportant Notice