Texas Instruments MSP430x11x1 warranty Principle characteristics of the DCO, JTAG/programming

Page 36

MSP430x11x1

MIXED SIGNAL MICROCONTROLLER

SLAS241C ± SEPTEMBER 1999 ± REVISED JUNE 2000

electrical characteristics over recommended ranges of supply voltage and operating free-air temperature (unless otherwise noted) (continued)

principle characteristics of the DCO

DIndividual devices have a minimum and maximum operation frequency. The specified parameters for fDCOx0 to fDCOx7 are valid for all devices.

DThe DCO control bits DCO0, DCO1 and DCO2 have a step size as defined in parameter SDCO.

DThe modulation control bits MOD0 to MOD4 select how often fDCO+1 is used within the period of 32 DCOCLK cycles. fDCO is used for the remaining cycles. The frequency is an average = fDCO (2MOD/32).

DThe ranges selected by RSel4 to RSel5, RSel5 to RSel6, and RSel6 to RSel7 are overlapping.

wake-up from lower power modes (LPMx)

 

PARAMETER

TEST CONDITIONS

MIN TYP MAX

UNIT

 

 

 

 

 

 

t(LPM0)

 

VCC = 2.2 V/3 V

 

100

ns

t(LPM2)

 

VCC = 2.2 V/3 V

 

100

 

 

 

 

 

f(MCLK) = 1 MHz,

VCC = 2.2 V/3 V

6

 

t(LPM3)

Delay time (see Note 22)

f(MCLK) = 2 MHz,

VCC = 2.2 V/3 V

6

s

 

f(MCLK) = 3 MHz,

VCC = 2.2 V/3 V

6

 

 

 

 

 

 

f(MCLK) = 1 MHz,

VCC = 2.2 V/3 V

6

 

t(LPM4)

 

f(MCLK) = 2 MHz,

VCC = 2.2 V/3 V

6

s

 

 

f(MCLK) = 3 MHz,

VCC = 2.2 V/3 V

6

 

NOTE 22: Parameter applicable only if DCOCLK is used for MCLK.

JTAG/programming

PARAMETER

TEST CONDITIONS

 

MIN

TYP

MAX

UNIT

 

 

 

 

 

 

 

f(TCK)

TCK frequency, JTAG/test (see Note 25)

VCC = 2.2 V

dc

 

5

MHz

VCC = 3 V

dc

 

10

 

 

 

 

V(FB)

Fuse blow voltage, C versions (see Notes 23 and 24)

VCC = 2.2 V/3 V

3.5

 

3.9

V

I(FB)

Supply current on TDI during fuse blow (see Note 24) (C11x1)

 

 

100

mA

t(FB)

Time to blow the fuse (see Note 24) (C11x1)

 

 

 

1

ms

I(DD-PGM)

Current during program cycle (see Note 26)

VCC = 2.7 V/3.6 V,

 

3

5

mA

MSP430F11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

I(DD-ERASE)

Current during erase cycle (see Note 26)

VCC = 2.7 V/3.6 V,

 

3

5

mA

MSP430F11x1

 

 

 

 

 

 

 

 

 

 

 

 

 

 

t(retention)

Write/erase cycles

MSP430F11x1

104

105

 

 

Data retention TJ = 25°C

MSP430F11x1

100

 

 

Year

 

 

 

NOTES: 23. The power source to blow the fuse is applied to TDI pin.

24.Once the JTAG fuse is blown, no further access to the MSP430 JTAG/test feature is possible. The JTAG block is switched to bypass mode.

25.f(TCK) may be restricted to meet the timing requirements of the module selected.

26.Duration of the program/erase cycle is determined by f(FTG) applied to the flash timing controller. It can be calculated as follows:

t(word write) = 35 x 1/f(FTG)

t(segment write, byte 0) = 30 1/f(FTG)

t(segment write, byte 1 ± 63) = 20 1/f(FTG) t(mass erase) = 5297 x 1/f(FTG)

t(page erase) = 4819 x 1/f(FTG)

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Image 36
Contents MSP430x11x1 DescriptionTssop Functional block diagram Available Options Packaged DevicesPIN Sowb PIN Tssop Pulldown resistor of 30 k Ω is needed on F11x1Terminal Functions Short-form descriptionProcessing unit Terminal Description NameAddress Mode Descriptions CPUInstruction set Instruction Word FormatsLow-power consumption capabilities Operation modes and interruptsStatus register R2 SCG1SCG0 SCG1 SCG0Interrupt vector addresses CaifgWdtifg CCIFG1, CCIFG2, TaifgSpecial function registers WdtifgOfifg NmiifgBoot ROM containing bootstrap loader Functions of the bootstrap loaderMemory organization Features of the bootstrap loader are Hardware resources used for serial input/outputWDT VCC RST/NMI PIN Test PINBootstrap loader Starts VCCTest InternalFlash memory Flash memory control register FCTL1Flash memory, timing generator, control register FCTL2 Erase 0128h, bit1, Erase a segmentWRT Flash memory control register FCTL3 FN0±FN5SSEL0, SSEL1 AclkBusy KeyvAccvifg WaitFlash memory, interrupt and security key violation LockEmex Accv PUCPOR NmirsPeripherals Oscillator and system clockClock Signals Digital I/OWatchdog timer TimerA Three capture/compare registersTimerA 3 capture/compare registers TimerA, MSP430x11x1 ConfigurationComparatorA Caout CAFCACTL2.4 CATCTL2.7Slope a/d conversion CACTL1Caex Caon Caies Caifg Rsel REF1 REF0 CACTL2Peripherals with Word Access Peripherals with Byte AccessPeripheral file map Absolute maximum ratings² Recommended operating conditionsMIN NOM MAX Units MSP430x11x1 Devices Frequency vs Supply VoltageParameter Test Conditions MIN TYP MAX Unit IAMILPM2 ILPM3Outputs Port 1 to P2 P1.0 to P1.7, P2.0 to P2.5 Leakage currentInternal signals TAx, Smclk at TimerA Inputs Px.x, TAxParameter Test Conditions VCC MIN TYP MAX Unit Port P1, P2 P1.x to P2.xOutputs P1.x, P2.x, TAx ComparatorA see NoteVRefVT vs Temperature, VCC = 3 V, C1121 VRefVT vs Temperature, VCC = 2.2 V, C1121PUC/POR CAF CaonRAM Parameter MIN NOM MAX UnitDCO Variance MaxDcoclk DCO StepsPrinciple characteristics of the DCO Wake-up from lower power modes LPMxJTAG/programming Input/output schematic Port P1, P1.0 to P1.3, input/output with Schmitt-triggerGND P1DIR.4 P1OUT.4 Smclk P1IFG.4 P1IES.4P1DIR.5 P1OUT.5 P1IFG.5 P1IES.5Port P2, P2.0 to P2.2, input/output with Schmitt-trigger CAPD.XPort P2, P2.3 to P2.4, input/output with Schmitt-trigger P2DIR.3 P2OUT.3P2IFG.3 P1IES.3 P2DIR.4 P2OUT.4P2SEL.5 VCC P2DIR.5P2OUT.5 P2IRQ.5Port P2, unbonded bits P2.6 and P2.7 Pins DIM MAX DW R-PDSO-GPlastic SMALL-OUTLINE Package PIN ShownPins Shown Pins DIM MAX MINPW R-PDSO-G Plastic SMALL-OUTLINE Package 15 NOM Gage Plane Seating Plane 20 MAXImportant Notice