Chapter 4 Troubleshooting the Installation
Troubleshooting the Cooling Subsystem
For additional power supply troubleshooting information, see the “Troubleshooting the Power
Subsystem” section on page
Note For the RSP to communicate properly to a power module, input power to at least one of the two power modules should be present.
Over-temperature Conditions
This console error message indicates that the system has detected an
Queued messages:
The preceding message could also indicate a faulty component or temperature sensor. Enter the show environment command or the show environment all command at the user EXEC prompt to display information about the internal system environment. The information generated by these commands includes:
•Voltage measurements on each card from the
•The +5 VDC for the I2C module
•Operating voltage for the fan tray
•Temperature measurements received by all sensors of RP and LC module as well as temperature measurements from sensors located in each power module
If an environmental shutdown results from an
Although an
•Heated exhaust air from other equipment in the immediate environment is not entering the chassis card cage vents.
•You allow sufficient air flow by maintaining a minimum of 6 inches (15.24 cm) of clearance at both the inlet and exhaust openings on the chassis and the power modules to allow cool air to enter freely and hot air to be expelled from the chassis.
Isolating Cooling Subsystem Problems
Use this procedure to isolate a problem with the chassis cooling system if you have an
Step 1 Make sure the fan tray is operating properly when you power on the system. To determine if the fan tray is operating, check the LED indicator on the fan tray front panel:
•OK
•Fail
•If neither indicator is on and the blower is not operating, there may be a problem with either the fan tray or the +12 VDC power supplied to the fan tray. Go to Step 2.
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