4.Remove the metal retaining clip that secures the heat sink assembly to the microprocessor package by gently pushing down on the folded part of the retaining clip with a small screwdriver.
The retaining clip hooks over the sides of the zero insertion force (ZIF) socket.
Figure 24. Heat Sink Assembly Removal
1Retaining clip
2Heat sink assembly
3Microprocessor package
4ZIF socket
5.Remove the heat sink assembly from the microprocessor package.
NOTICE: Be careful not to bend any of the pins when you remove the microprocessor package from the ZIF socket. Bending the pins can permanently damage the microprocessor.
6.Detach and lift the microprocessor package away from the ZIF socket.
The ZIF socket has a
a.Pull the socket release lever straight out until the microprocessor package is released.
b.Remove the microprocessor package from the socket.
Leave the release lever extended so that the socket is ready for the new microprocessor.
Figure 25. Microprocessor Package Removal
1Microprocessor package
2Socket release lever
3ZIF socket
7.Unpack the new microprocessor package.
If any of the pins on the new microprocessor appear to be bent, return the microprocessor package.
NOTICE: You must position the microprocessor package correctly in the ZIF socket to avoid permanent damage to the microprocessor and the computer when you turn on the system.
8.Install the microprocessor package in the ZIF socket.
a.If the release lever on the ZIF socket is not all the way out, move it to that position.
b.Align
c.Set the microprocessor package lightly in the socket, making sure that all the pins are headed into the correct holes.
Because the system uses a ZIF socket, there is no need to use force (which could bend the pins if the microprocessor package is misaligned).
d.When the microprocessor package is positioned correctly, press it with minimal pressure to fully seat it in the ZIF socket.
e.When the microprocessor package is fully seated, pivot the release lever back toward the system board until it snaps into place,
