Motorola MC9S12DG128B, MC9S12DT128B manual A.1.8 Power Dissipation and Thermal Characteristics

MC9S12DT128B Device User Guide — V01.07

calculations refer to Section A.1.8 Power Dissipation and Thermal Characteristics.

Table A-4 Operating Conditions

Rating	Symbol	Min	Typ	Max	Unit
I/O, Regulator and Analog Supply Voltage	VDD5	4.5	5	5.25	V
Digital Logic Supply Voltage 1	VDD	2.35	2.5	2.75	V
PLL Supply Voltage 2	VDDPLL	2.25	2.5	2.75	V
Voltage Difference VDDX to VDDR and VDDA	ΔVDDX	-0.1	0	0.1	V
Voltage Difference VSSX to VSSR and VSSA	ΔVSSX	-0.1	0	0.1	V
Oscillator	fosc	0.5	-	16	MHz
Bus Frequency	fbus	0.5	-	25	MHz
MC9S12DT128BC
Operating Junction Temperature Range	T	-40	-	100	°
	J				C
Operating Ambient Temperature Range 2	TA	-40	27	85	°C
MC9S12DT128BV
Operating Junction Temperature Range	T	-40	-	120	°
	J				C
Operating Ambient Temperature Range 2	TA	-40	27	105	°C
MC9S12DT128BM
Operating Junction Temperature Range	T	-40	-	140	°
	J				C
Operating Ambient Temperature Range 2	TA	-40	27	125	°C
NOTES:

1.The device contains an internal voltage regulator to generate the logic and PLL supply out of the I/O supply. The absolute maximum ratings apply when this regulator is disabled and the device is powered from an external source.

2.Please refer to Section A.1.8 Power Dissipation and Thermal Characteristics for more details about the rela- tion between ambient temperature TA and device junction temperature TJ.

A.1.8 Power Dissipation and Thermal Characteristics

Power dissipation and thermal characteristics are closely related. The user must assure that the maximum operating junction temperature is not exceeded. The average chip-junction temperature (TJ) in °C can be obtained from:

TJ = TA + (PD ∙ ΘJA)

TJ = Junction Temperature, [°C ]

TA = Ambient Temperature, [°C ]

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