Motorola MC9S12DB128B manual A.1.9 I/O Characteristics, Table A-5 Thermal Package Characteristics1

MC9S12DT128B Device User Guide — V01.07

Table A-5 Thermal Package Characteristics1

Num	C	Rating	Symbol	Min	Typ	Max	Unit
1	T	Thermal Resistance LQFP112, single sided PCB2	θJA	–	–	54	oC/W
2	T	Thermal Resistance LQFP112, double sided PCB	θJA	–	–	41	oC/W
		with 2 internal planes3
3	T	Junction to Board LQFP112	θJB	–	–	31	oC/W
4	T	Junction to Case LQFP112	θJC	–	–	11	oC/W
5	T	Junction to Package Top LQFP112	ΨJT	–	–	2	oC/W
6	T	Thermal Resistance QFP 80, single sided PCB	θJA	–	–	51	oC/W
7	T	Thermal Resistance QFP 80, double sided PCB with	θJA	–	–	41	oC/W
		2 internal planes
8	T	Junction to Board QFP80	θJB	–	–	27	oC/W
9	T	Junction to Case QFP80	θJC	–	–	14	oC/W
10	T	Junction to Package Top QFP80	ΨJT	–	–	3	oC/W

NOTES:

1.The values for thermal resistance are achieved by package simulations

2.PC Board according to EIA/JEDEC Standard 51-3

3.PC Board according to EIA/JEDEC Standard 51-7

A.1.9 I/O Characteristics

This section describes the characteristics of all 5V I/O pins. All parameters are not always applicable, e.g. not all pins feature pull up/down resistances.

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