Mechanical Information

7.1 Mechanical Information

The MSP50C614, MSP50C605, and the MSP50C601 are normally sold in die form, but are also available in a 100-pin QFP package. The MSP50C604 is a available in die form and in a 64-pin QFP package. The MSP50P614 is available in a 120-pin, PGA-windowed ceramic package.

NOTE: Scan Port Bond Out

The scan port interface on the MSP50C6xx devices has five dedicated pins and one shared pin that need to be used by the MSP50Cxx code development tools. The SCANIN, SCANOUT, SCANCLK, SYNC, and TEST pins are dedicated to the scan port interface. The RESET pin is shared with the application. These pins may play an important role in debugging any system problems. For this reason, these pins must be bonded out on any MSP50C614 production board. Furthermore, it is recommended that these pins be connected to test points, so the development tool can be connected. Since the development tool requires VDD and VSS, test points connected to these signals are also needed.

The application circuits appearing in section 6.1 show the minimum recommended configuration for any MSP50C614 application board. For production purposes, the 1-kresistor which appears at the RESET pin is optional. It is required for use with the scan port interface, but they may be shorted otherwise. The footprints for this resistor are strongly recommended.

7.1.1Die Bond-Out Coordinates

Die bond-out coordinates are available upon request from Texas Instruments (email: speak2me@list.ti.com).

7.1.2Package Information

The MSP50C614, MSP50C605, and the MSP50C601 are available in the 100-pin QFP package. See Figure 7–1 and Tables 7–1 thru 7–3. The MSP50C604 is a available the 64-pin QFP package. See Figure 7–2 and Table 7–4. For more detailed information, please refer to the device datasheets available on the TI speech web site (http://www.ti.com/sc/speech).

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Texas Instruments MSP50C6xx manual Mechanical Information, Die Bond-Out Coordinates, Package Information