Intel 5400 Series manual Performance Targets

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Thermal/Mechanical Reference Design

Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or

Section 2.2.8 for the Thermal Profile A and Thermal Profile B specifications. Section 2.5 of this document also provides details on the 2U+ and 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A and Thermal Profile B respectively.

2.2.7.2Thermal Profile Concept for the Quad-Core Intel® Xeon® Processor E5400/X5482 Series

The Quad-Core Intel® Xeon® Processor E5400 Series is designed to go into various form factors, including the volumetrically constrained 1U and custom blade form factors. The Quad-Core Intel® Xeon® Processor X5482 is designed to go into volumetrically unconstrained workstation platforms only. Intel has developed single thermal profile for E5400/X5482 Series.

Designing to the Thermal Profile ensures that no measurable performance loss due to Thermal Control Circuit (TCC) activation is observed in the processor. It is expected that TCC would only be activated for very brief periods of time when running a worst- case real world application in a worst-case thermal condition. These brief instances of TCC activation are not expected to impact the performance of the processor. A worst case real world application is defined as a commercially available, useful application which dissipates a power equal to, or above, the TDP for a thermally relevant timeframe. One example of a worst-case thermal condition is when a processor local ambient temperature is at or above 43.2°C for Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile.

Thermal solutions that exceed the Thermal Profile specification are considered incompliant and will adversely affect the long-term reliability of the processor.

Refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet or

Section 2.2.8 for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile specifications. Section 2.5 and Appendix A of this document provide details on 1U Intel reference thermal solutions that are designed to meet the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile.

2.2.8Performance Targets

The Thermal Profile specifications for this processor are published in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet. These Thermal Profile specifications are shown as a reference in the subsequent discussions.

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description Terms and Descriptions Sheet 2 TDPIntroduction Mechanical Requirements Processor Mechanical ParametersProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Thermal Monitor for Multiple Core Products PROCHOT#, THERMTRIP#, and FORCEPR#Heatpipe Orientation for Multiple Core Processors Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlProcessor Thermal Characterization Parameter Relationships Fan Speed Control, Tcontrol and DTS RelationshipEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAChassis Thermal Design Considerations Chassis Thermal Design Capabilities and ImprovementsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink CEK Heatsink Thermal Mechanical Characteristics Recommended Thermal Grease Dispense WeightThermal Interface Material TIM Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Test Procedure Examples Time-Zero, Room Temperature Preload MeasurementTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Environmental Reliability Testing Structural Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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