Intel 5400 Series manual Thermal/Mechanical Reference Design

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Thermal/Mechanical Reference Design

2.5.8Boxed Active Thermal Solution for the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile

Intel will provide a 2U passive and a 1U passive/active heatsink solution for boxed Quad-Core Intel® Xeon® Processor 5400 Series. This active heatsink solution is primarily designed to be used in a pedestal chassis where sufficient air inlet space is present and side directional airflow is not an issue. This active heatsink solution consists of a 4 wire PWM fan and a 1U passive heatsink compatible with 1U form factors both mechanically and thermally. These solutions are intended for system integrators who build systems from components available through distribution channels. The retention solution used for these products is called the CEK. The CEK base is compatible with all the heatsink solutions.

Figure 2-26provides a representation of the active CEK solution. This design is based on a 4-pin PWM PECI/DTS controlled active fan heatsink solution. PWM (Pulse Width Modulation also synonymous with Pulse Duration Modulation PDM) is a modulation in which the duration of pulse is varied in accordance with some characteristic of the modulating signal. This solution is being offered to help provide better control over pedestal chassis acoustics. This is achieved though accurate measurement of processor temperature through the processor’s Digital Thermal Sensor (DTS) temperature. Fan RPM is modulated through the use of an ASIC (Application Specific Integrated Circuit) located on the serverboard, that sends out a PWM control signal to the 4th pin of the connector labeled as Control.

This heatsink solution also requires a constant +12 V supplied to pin 2 and does not support variable voltage control or 3-pin PWM control. If no PWM signal is detected on the 4th pin this heatsink solution will revert back to thermistor control mode, supporting both the 4-wire PWM and standard 3-wire ambient air control methods.

The active heatsink solution will not exceed a mass of approximately 1050 grams. Note that this is per processor, so a dual processor system will have up to approximately 2100 grams total mass in the heatsinks. This large mass will require a minimum chassis stiffness to be met in order to withstand force during shock and vibration.

Figure 2-26. Boxed Active CEK Heatsink Solutions with PWM/DTS Control (Representation Only)

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2Introduction Processor Mechanical Parameters Mechanical RequirementsProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation PROCHOT#, THERMTRIP#, and FORCEPR# Thermal Monitor for Multiple Core ProductsHeatpipe Orientation for Multiple Core Processors Processor Input Processor OutputFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance RequirementsFan Speed Control, Tcontrol and DTS Relationship Processor Thermal Characterization Parameter RelationshipsEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeEquation 2-4.ΨCA= ΨCS + ΨSA ExampleChassis Thermal Design Capabilities and Improvements Chassis Thermal Design ConsiderationsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Recommended Thermal Grease Dispense Weight CEK Heatsink Thermal Mechanical CharacteristicsThermal Interface Material TIM Processor Minimum Maximum Units24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Time-Zero, Room Temperature Preload Measurement Test Procedure ExamplesTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Structural Reliability Testing Environmental Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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