Intel 5400 Series manual =0.187* X +40, Equation 2-9.y = 0.246*X +

Page 43

Thermal/Mechanical Reference Design

Figure 2-19. 2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile A

	65	TCASE_MAX_B@ TDP
	60
C)						Thermal ProfileA
(	55					Y =0.168* X +42.8
Temperature	55					Y =0.168* X +42.8
	50
												2U CEK ReferenceSolution
												2U CEK ReferenceSolution
													Y =0.187* X +40
	45
	40																				120
	0	5	10	15	20	25	30	35	40	45	50	55	60	65	70	75	80	90	100	110	120
													Power (W)								TDP

The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile B for the Quad-Core Intel® Xeon® Processor X5400 Series. From Table 2-7the three- sigma (mean+3sigma) performance of the thermal solution is computed to be 0.246°C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation 2-9.y = 0.246*X + 40

where,

y = Processor TCASE value (°C) x = Processor power value (W)

Figure 2-20below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile B with 0.5°C margin at the upper end (TDP). However, as explained in Section 2.2.7, designing to Thermal Profile B results in increased TCC activation and measurable performance loss for the processor.

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

43

Image 43

Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters TableQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core ProcessorsFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance RequirementsCondition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDPEquation 2-4.ΨCA= ΨCS + ΨSA ExampleEquation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference DesignsPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg