Introduction
1Introduction
1.1Objective
The purpose of this guide is to describe the reference thermal solution and design parameters required for the
It is also the intent of this document to comprehend and demonstrate the processor cooling solution features and requirements. Furthermore, this document provides an understanding of the processor thermal characteristics, and discusses guidelines for meeting the thermal requirements imposed over the entire life of the processor. The thermal/mechanical solutions described in this document are intended to aid component and system designers in the development and evaluation of processor compatible thermal/mechanical solutions.
1.2Scope
The thermal/mechanical solutions described in this document pertain to a solution(s) intended for use with the
1.3 References
Material and concepts available in the following documents may be beneficial when reading this document.
Table | Reference Documents (Sheet 1 of 2) |
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| Document | Comment |
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| European Blue Angel Recycling Standards | |
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| Intel® Xeon® Dual- and Multi- Processor Family Thermal Test Vehicle | See Note at bottom table. |
| User's Guide |
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| LGA771 Socket Mechanical Design Guide | See Note following table. |
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| LGA771 SMT Socket Design Guidelines | See Note following table. |
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| LGA771 Daisy Chain Test Vehicle User Guide | See Note following table. |
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| Stoakley Platform Design Guide (PDG) | See Note following table. |
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| See Note following table. | |
| Guide (PDG) |
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| See Note following table. | |
| Guide (PDG) |
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| Clovertown, Harpertown & | See Note following table. |
| Guide for Bensley, |
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| PECI Feature Set Overview | See Note following table |
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| Platform Environment Control Interface(PECI) Specification | See Note following table |
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| See Note following table. | |
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| Available electronically | |
| Package Mechanical Models (in IGES and ProE* format) |
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