Intel 5400 Series manual Supplier Information, Intel Enabled Suppliers

Page 95

Enabled Suppliers Information

FEnabled Suppliers Information

F.1 Supplier Information

F.1.1 Intel Enabled Suppliers

The Intel reference enabling solution for Quad-Core Intel® Xeon® Processor 5400 Series is preliminary. The Intel reference solutions have not been verified to meet the criteria outlined in Appendix E. Customers can purchase the Intel reference thermal solution components from the suppliers listed in Table F-1.

For additional details, please refer to the Quad-Core Intel® Xeon® Processor 5400 Series thermal mechanical enabling components drawings in Appendix B.

Table F-1. Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2)

	Assembly	Component	Description	Development	Supplier Contact Info
	Assembly	Component	Description	Suppliers	Supplier Contact Info
				Suppliers

	CEK771-01-2U	CEK Heatsink	Copper Fin, Copper	Fujikura	Fujikura America
	(for 2U, 2U+)		Base	CNDA# 1242012	Ash Ooe
		Intel Reference		(stacked fin)	a_ooe@fujikura.com
		Heatsink p/n			408-748-6991
		C61708 rev03
					Fujikura Taiwan Branch
		Intel Boxed			Yao-Hsien Huang
		Heatsink p/n	includes PCM45F		yeohsien@fujikuratw.com.tw
		D36871	includes PCM45F		886(2)8788-4959
		D36871	TIM+cover		886(2)8788-4959
			TIM+cover

		CEK Heatsink	Copper Fin, Copper	Furukawa	Tim Yu
			Base	CNDA# 65755	Yu@FurukawaAmerica.com
				(Crimped fin)	408-345-1520
		Intel Boxed			Johnson Tseng
		Heatsink p/n	includes PCM45F		Johnson@tfe.com.tw
		D36871	TIM+cover		(02)2563-8148x15

		Thermal Interface	Grease	Shin-Etsu G751	Randy Isaacson
		Material		CNDA 75610	risaacson@microsi.com
					(480) 893-8898x113

		CEK Spring for	Stainless Steel 301,	AVC	Steve Huang (APAC)
		LGA771 socket	Kapton* Tape on	CNDA# AP5281	+86-755-3366-8888 x66888
			Reinforced Spring		+86-138-252-45215
		Intel p/n D13646	Fingers		steve@avc.com.cn
		Intel p/n D13646
		rev04			Huabin Chen (China Only)
					Huabin Chen (China Only)
					+886-755-3366-8888 x66871
					huabin@avc.com.cn

		CEK Spring for	Stainless Steel 301,	ITW Fastex	Roger Knell
		LGA771 socket	Kapton* Tape on	CNDA# 78538	rknell@itwfastex.com
			Reinforced Spring		773-307-9035
		Intel p/n D13646	Fingers		Henry Lu
		rev04			Henry Lu
					henry@mail.itwasia.com.tw
					886-7-881-9206x10

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 TDP Terms and Descriptions Sheet 2Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters TableQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core ProcessorsFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Fan Speed Control Characterizing Cooling Solution Performance RequirementsCondition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDPEquation 2-4.ΨCA= ΨCS + ΨSA ExampleEquation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference DesignsTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg