Intel 5400 Series manual Isometric View of the 2U+ CEK Heatsink

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Thermal/Mechanical Reference Design

Figure 2-22. Isometric View of the 2U+ CEK Heatsink

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

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Figure 2-23. Isometric View of the 1U CEK Heatsink

Note: Refer to Appendix B for more detailed mechanical drawings of the heatsink.

The function of the standoffs is to provide a bridge between the chassis and the heatsink for attaching and load carrying. When assembled, the heatsink is rigid against the top of the standoff, and the standoff is rigid to a chassis standoff with the CEK spring firmly sandwiched between the two. In dynamic loading situations the standoff carries much of the heatsink load, especially in lateral conditions, when compared to the amount of load transmitted to the processor package. As such, it is comprised of steel. The distance from the bottom of the heatsink to the bottom of the standoff is

8.79mm [0.346 in.] for a board thickness of 1.57 mm [0.062 in]. The standoff will need to be modified for use in applications with a different board thickness, as defined in Section 2.5.4.2.

The function of the screw is to provide a rigid attach method to sandwich the entire CEK assembly together, activating the CEK spring under the baseboard, and thus providing the TIM preload. A screw is an inexpensive, low profile solution that does not negatively impact the thermal performance of the heatsink due to air blockage. Any fastener (i.e. head configuration) can be used as long as it is of steel construction; the head does not interfere with the heatsink fins, and is of the correct length of 20.64 mm [0.8125 in.].

46	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description Terms and Descriptions Sheet 2 TDPIntroduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlEquation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg