Intel 5400 Series manual Terms and Descriptions Sheet 2, Tdp

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Introduction

Table 1-2.

Terms and Descriptions (Sheet 2 of 2)

 

 

 

 

TCONTROL

A processor unique value for use in fan speed control mechanisms. TCONTROL is a

 

 

temperature specification based on a temperature reading from the processor’s Digital

 

 

Thermal Sensor. TCONTROL can be described as a trigger point for fan speed control

 

 

implementation. TCONTROL = -TOFFSET.

 

TOFFSET

An offset value from the TCC activation temperature value programmed into each

 

 

processor during manufacturing and can be obtained by reading the

 

 

IA_32_TEMPERATURE_TARGET MSR. This is a static and a unique value. Refer to the

 

 

RS - Wolfdale Processor Family BIOS Writers Guide (BWG) for further details.

 

 

 

 

TDP

Thermal Design Power: Thermal solution should be designed to dissipate this target

 

 

power level. TDP is not the maximum power that the processor can dissipate.

 

 

 

 

Thermal Monitor

A feature on the processor that can keep the processor’s die temperature within factory

 

 

specifications under normal operating conditions.

 

 

 

 

Thermal Profile

Line that defines case temperature specification of a processor at a given power level.

 

 

 

 

TIM

Thermal Interface Material: The thermally conductive compound between the heatsink

 

 

and the processor case. This material fills the air gaps and voids, and enhances the

 

 

transfer of the heat from the processor case to the heatsink.

 

 

 

 

TLA

The measured ambient temperature locally surrounding the processor. The ambient

 

 

temperature should be measured just upstream of a passive heatsink or at the fan inlet

 

 

for an active heatsink.

 

 

 

 

TSA

The system ambient air temperature external to a system chassis. This temperature is

 

 

usually measured at the chassis air inlets.

UA unit of measure used to define server rack spacing height. 1U is equal to 1.75 in, 2U equals 3.50 in, etc.

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 TDP Terms and Descriptions Sheet 2Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters TableQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core ProcessorsFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Fan Speed Control Characterizing Cooling Solution Performance RequirementsCondition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDPEquation 2-4.ΨCA= ΨCS + ΨSA ExampleEquation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference DesignsTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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