Intel 5400 Series manual Digital Thermal Sensor

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Thermal/Mechanical Reference Design

processor operating frequency (via the bus multiplier) and input voltage (via the VID signals). Please refer to the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for further details on TM and TM2.

PROCHOT# is designed to assert at or a few degrees higher than maximum TCASE (as specified by the thermal profile) when dissipating TDP power, and can not be

interpreted as an indication of processor case temperature. This temperature delta accounts for processor package, lifetime, and manufacturing variations and attempts to ensure the Thermal Control Circuit is not activated below maximum TCASE when dissipating TDP power. There is no defined or fixed correlation between the PROCHOT# assertion temperature and the case temperature. However, with the introduction of the Digital Thermal Sensor (DTS) on the Quad-Core Intel® Xeon® Processor 5400 Series, the DTS reports a relative offset below the PROCHOT# assertion (see Section 2.2.2 for more details on the Digital Thermal Sensor). Thermal solutions must be designed to the processor specifications (i.e Thermal Profile) and can not be adjusted based on experimental measurements of TCASE, PROCHOT#, or Digital Thermal Sensor on random processor samples.

By taking advantage of the Thermal Monitor features, system designers may reduce thermal solution cost by designing to the Thermal Design Power (TDP) instead of maximum power. TDP should be used for processor thermal solution design targets. TDP is not the maximum power that the processor can dissipate. TDP is based on measurements of processor power consumption while running various high power applications. This data set is used to determine those applications that are interesting from a power perspective. These applications are then evaluated in a controlled thermal environment to determine their sensitivity to activation of the thermal control circuit. This data set is then used to derive the TDP targets published in the processors datasheet. The Thermal Monitor can protect the processors in rare workload excursions above TDP. Therefore, thermal solutions should be designed to dissipate this target power level. The thermal management logic and thermal monitor features are discussed in extensive detail in the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet.

In addition, on-die thermal management features called THERMTRIP# and FORCEPR# are available on the Quad-Core Intel® Xeon® Processor 5400 Series. They provide a thermal management approach to support the continued increases in processor frequency and performance. Please see the Quad-Core Intel® Xeon® Processor 5400 Series Datasheet for guidance on these thermal management features.

2.2.2Digital Thermal Sensor

The Quad-Core Intel® Xeon® Processor 5400 Series include on-die temperature sensor feature called Digital Thermal Sensor (DTS). The DTS uses the same sensor utilized for TCC activation. Each individual processor is calibrated so that TCC activation occurs at a DTS value of 0. The temperature reported by the DTS is the relative offset in PECI counts below the onset of the TCC activation and hence is negative. Changes in PECI counts are roughly linear in relation to temperature changes in degrees Celsius. For example, a change in PECI count by '1' represents a change in temperature of approximately 1°C. However, this linearity cannot be guaranteed as the offset below TCC activation exceeds 20-30 PECI counts. Also note that the DTS will not report any values above the TCC activation temperature, it will simply return 0 in this case.

The DTS facilitates the use of multiple thermal sensors within the processor without the burden of increasing the number of thermal sensor signal pins on the processor package. Operation of multiple DTS will be discussed in more detail in Section 2.2.4. Also, the DTS utilizes thermal sensors that are optimally located when compared with thermal diodes available with legacy processors. This is achieved as a result of a

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 Terms and Descriptions Sheet 2 TDPIntroduction Mechanical Requirements Processor Mechanical ParametersProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Thermal Monitor for Multiple Core Products PROCHOT#, THERMTRIP#, and FORCEPR#Heatpipe Orientation for Multiple Core Processors Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Characterizing Cooling Solution Performance Requirements Fan Speed ControlProcessor Thermal Characterization Parameter Relationships Fan Speed Control, Tcontrol and DTS RelationshipEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAChassis Thermal Design Considerations Chassis Thermal Design Capabilities and ImprovementsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink CEK Heatsink Thermal Mechanical Characteristics Recommended Thermal Grease Dispense WeightThermal Interface Material TIM Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Test Procedure Examples Time-Zero, Room Temperature Preload MeasurementTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Environmental Reliability Testing Structural Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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