Intel 5400 Series manual Figures

Page 4

D

Safety Requirements

89

E

Quality and Reliability Requirements

91

 

E.1 Intel Verification Criteria for the Reference Designs

91

 

E.1.1 Reference Heatsink Thermal Verification

91

 

E.1.2

Environmental Reliability Testing

91

 

E.1.3 Material and Recycling Requirements

93

F

Enabled Suppliers Information

95

 

F.1 Supplier Information

95

 

F.1.1

Intel Enabled Suppliers

95

 

F.1.2

Additional Suppliers

96

Figures

2-1

Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (1 of 3)

15

2-2

Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (2 of 3)

16

2-3

Quad-Core Intel® Xeon® Processor 5400 Series Mechanical Drawing (3 of 3)

17

2-4

Processor Case Temperature Measurement Location

19

2-5

DTS Domain for Quad-Core Intel® Xeon® Processor 5400 Series

21

2-6

Processor Core Geometric Center Locations

23

2-7

Thermal Profile Diagram

24

2-8

TCONTROL Value and Digital Thermal Sensor Value Interaction

25

2-9

TCONTROL and Thermal Profile Interaction

26

2-10

Dual Thermal Profile Diagram

27

2-11

Thermal Profile for the Quad-Core Intel® Xeon® Processor X5400 Series

29

2-12

Thermal Profile for Quad-Core Intel® Xeon® Processor E5400 Series

30

2-13

Thermal Profile for Quad-Core Intel® Xeon® Processor X5482 Series

31

2-14

TCONTROL and Fan Speed Control

33

2-15

Processor Thermal Characterization Parameter Relationships

35

2-16

Exploded View of CEK Thermal Solution Components

39

2-17

2U+ CEK Heatsink Thermal Performance

41

2-18

1U

CEK Heatsink Thermal Performance

42

2-19

2U+CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

 

 

Series Thermal Profile A

43

2-20

1U

CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400

 

 

Series Thermal Profile B

44

2-21

1U

CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor E5400

 

 

Series Thermal Profile

45

2-22

Isometric View of the 2U+ CEK Heatsink

46

2-23

Isometric View of the 1U CEK Heatsink

46

2-24

CEK Spring Isometric View

48

2-25

Isometric View of CEK Spring Attachment to the Base Board

48

2-26

Boxed Active CEK Heatsink Solutions with PWM/DTS Control

 

 

(Representation Only)

49

2-27

Fan Cable Connection (Active CEK)

50

A-1

Isometric View of the 1U Alternative Heatsink

53

A-2

1U

Alternative Heatsink Thermal Performance

54

A-3

1U

Alternative Heatsink Thermal Adherence to Quad-Core Intel® Xeon®

 

 

Processor L5400 Series Thermal Profile

55

B-1

2U

CEK Heatsink (Sheet 1 of 4)

58

B-2

2U

CEK Heatsink (Sheet 2 of 4)

59

B-3

2U

CEK Heatsink (Sheet 3 of 4)

60

B-4

2U

CEK Heatsink (Sheet 4 of 4)

61

4

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description Terms and Descriptions Sheet 2 TDPIntroduction Mechanical Requirements Processor Mechanical ParametersProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Thermal Monitor for Multiple Core Products PROCHOT#, THERMTRIP#, and FORCEPR#Heatpipe Orientation for Multiple Core Processors Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlProcessor Thermal Characterization Parameter Relationships Fan Speed Control, Tcontrol and DTS RelationshipEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAChassis Thermal Design Considerations Chassis Thermal Design Capabilities and ImprovementsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink CEK Heatsink Thermal Mechanical Characteristics Recommended Thermal Grease Dispense WeightThermal Interface Material TIM Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Test Procedure Examples Time-Zero, Room Temperature Preload MeasurementTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Environmental Reliability Testing Structural Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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