Intel 5400 Series manual Definition of Terms, Terms and Descriptions Sheet 1, Term Description

Page 10

 

 

Introduction

Table 1-1. Reference Documents (Sheet 2 of 2)

 

 

 

 

 

Document

Comment

 

 

 

 

Clovertown_Harpertown_Wolfdale-DP Processor Enabled Components

Available electronically

 

CEK Thermal Models (in Flotherm* and Icepak*)

 

 

 

 

 

Clovertown_Harpertown_Wolfdale-DP Processor Package Thermal

Available electronically

 

Models (in Flotherm and Icepak)

 

 

 

 

 

RS - Wolfdale Processor Family BIOS Writers Guide (BWG)

See Note following table.

 

 

 

 

Thin Electronics Bay Specification (A Server System Infrastructure (SSI)

www.ssiforum.com

 

Specification for Rack Optimized Servers

 

 

 

 

Note: Contact your Intel field sales representative for the latest revision and order number of this document.

1.4Definition of Terms

Table 1-2.

Terms and Descriptions (Sheet 1 of 2)

 

 

 

 

Term

Description

 

 

 

 

Bypass

Bypass is the area between a passive heatsink and any object that can act to form a

 

 

duct. For this example, it can be expressed as a dimension away from the outside

 

 

dimension of the fins to the nearest surface.

 

 

 

 

DTS

Digital Thermal Sensor replaces the Tdiode in previous products and uses the same

 

 

sensor as the PROCHOT# sensor to indicate the on-die temperature. The temperature

 

 

value represents the number of degrees below the TCC activation temperature.

 

 

 

 

MSR

The processor provides a variety of model specific registers that are used to control and

 

 

report on processor performance. Virtually all MSRs handle system related functions and

 

 

are not accessible to an application program.

 

 

 

 

FMB

Flexible Motherboard Guideline: an estimate of the maximum value of a processor

 

 

specification over certain time periods. System designers should meet the FMB values to

 

 

ensure their systems are compatible with future processor releases.

 

 

 

 

FSC

Fan Speed Control

 

 

 

 

IHS

Integrated Heat Spreader: a component of the processor package used to enhance the

 

 

thermal performance of the package. Component thermal solutions interface with the

 

 

processor at the IHS surface.

 

 

 

 

LGA771 Socket

The Quad-Core Intel® Xeon® Processor 5400 Series interfaces to the baseboard

 

 

through this surface mount, 771 Land socket. See the LGA771 Socket Mechanical

 

 

Design Guide for details regarding this socket.

 

 

 

 

PMAX

The maximum power dissipated by a semiconductor component.

 

PECI

A proprietary one-wire bus interface that provides a communication channel between

 

 

Intel processor and chipset components to external thermal monitoring devices, for use

 

 

in fan speed control. PECI communicates readings from the processors Digital Thermal

 

 

Sensor. PECI replaces the thermal diode available in previous processors.

 

 

 

 

ΨCA

Case-to-ambient thermal characterization parameter (psi). A measure of thermal

 

 

solution performance using total package power. Defined as (TCASE – TLA) / Total

 

 

Package Power. Heat source should always be specified for Ψ measurements.

 

 

 

 

ΨCS

Case-to-sink thermal characterization parameter. A measure of thermal interface

 

 

material performance using total package power. Defined as (TCASE – TS) / Total

 

 

Package Power.

 

 

 

 

ΨSA

Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal

 

 

performance using total package power. Defined as (TS – TLA) / Total Package Power.

 

TCASE

The case temperature of the processor, measured at the geometric center of the topside

 

 

of the IHS.

 

 

 

 

TCASE_MAX

The maximum case temperature as specified in a component specification.

 

TCC

Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature

 

 

by using clock modulation and/or operating frequency and input voltage adjustment

 

 

when the die temperature is very near its operating limits.

 

 

 

10

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description Terms and Descriptions Sheet 2 TDPIntroduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlEquation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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