Intel 5400 Series manual Thermal/Mechanical Reference Design

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Thermal/Mechanical Reference Design

The other items listed in Figure 2-16that are required to complete this solution will be shipped with either the chassis or boards. They are as follows:

•CEK Spring (supplied by baseboard vendors)

•Heatsink standoffs (supplied by chassis vendors)

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52	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description Terms and Descriptions Sheet 2 TDPIntroduction Mechanical Requirements Processor Mechanical ParametersProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation Thermal Monitor for Multiple Core Products PROCHOT#, THERMTRIP#, and FORCEPR#Heatpipe Orientation for Multiple Core Processors Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlProcessor Thermal Characterization Parameter Relationships Fan Speed Control, Tcontrol and DTS RelationshipEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAChassis Thermal Design Considerations Chassis Thermal Design Capabilities and ImprovementsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink CEK Heatsink Thermal Mechanical Characteristics Recommended Thermal Grease Dispense WeightThermal Interface Material TIM Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Test Procedure Examples Time-Zero, Room Temperature Preload MeasurementTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Environmental Reliability Testing Structural Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg