Intel 5400 Series Systems Considerations Associated with the Active CEK, Boxed Processor Contents

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Thermal/Mechanical Reference Design

Table 2-10. Fan Cable Connector Pin Out (Active CEK)

Pin Number

Signal

Color

 

 

 

1

Ground (Constant)

Black

 

 

 

2

Power (+12V)

Yellow

 

 

 

3

Signal: 2 pulses per revolution

Green

 

 

 

4

Control 21KHz - 28KHz

Blue

 

 

 

2.5.8.2Systems Considerations Associated with the Active CEK

This heatsink was designed to help pedestal chassis users to meet the processor thermal requirements without the use of chassis ducting. It may be necessary to

implement some form of chassis air guide or air duct to meet the TLA temperature of 40 °C depending on the pedestal chassis layout. Also, while the active heatsink solution is designed to mechanically fit into a 2U chassis, it may require additional space at the top of the heatsink to allow sufficient airflow into the heatsink fan. Therefore, additional design criteria may need to be considered if this heatsink is used in a 2U rack mount chassis, or in a chassis that has drive bay obstructions above the inlet to the fan heatsink.

Thermal Profile A should be used to help determine the thermal performance of the platform. The primary recommended control method for this solution is using pulse width modulation control. This control method requires the motherboard provide the correct PWM duty cycle to the active fan heatsink solution to properly follow the thermal profile. If no PWM signal is detected the active heatsink solution will default back to a thermistor controlled mode and the fan will automatically adjust fan RPM to meet the thermal profile.

It is critical to supply a constant +12 V to the fan header so that the active CEK heatsink solution can operate properly. If a system board has a jumper setting to select either a constant +12 V power to the fan header or a variable voltage, it is strongly recommended that the jumper be set by default to the constant +12 V setting.

It is recommended that the ambient air temperature outside of the chassis be kept at or below 35 °C. The air passing directly over the processor heatsink should not be preheated by other system components. Meeting the processor’s temperature specification is the responsibility of the system integrator.

2.5.8.3Boxed Processor Contents

A direct chassis attach method must be used to avoid problems related to shock and vibration, due to the weight of the heatsink required to cool the processor. The board must not bend beyond specification in order to avoid damage. The boxed processor contains the components necessary to solve both issues. The boxed processor will include the following items:

•Quad-Core Intel® Xeon® Processor 5400 Series

•Unattached heatsink solution

•4 screws, 4 springs, and 4 heatsink standoffs (all captive to the heatsink)

•Thermal Interface Material (pre-applied on heatsink)

•Installation Manual

•Intel Inside→ logo

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg Objective ScopeReferences Definition of Terms Terms and Descriptions Sheet 1Term Description TDP Terms and Descriptions Sheet 2Introduction Parameter Minimum Maximum Unit Mechanical RequirementsProcessor Mechanical Parameters Processor Mechanical Parameters TableQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Platform Environmental Control Interface Peci Multiple Core Special ConsiderationsMultiple Digital Thermal Sensor Operation Processor Input Processor Output Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Heatpipe Orientation for Multiple Core ProcessorsFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Parameter Maximum Unit 2U+ CEK, Thermal Profile a1U CEK, Thermal Profile B Fan Fail Guidelines Sea-Level1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance RequirementsCondition FSC Scheme Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Equation 2-3.ΨCA= Tcase TLA / TDPEquation 2-4.ΨCA= ΨCS + ΨSA ExampleEquation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/WHeatsink Solutions Thermal/Mechanical Reference Design ConsiderationsHeatsink Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Processor Minimum Maximum Units CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Thermal Interface Material TIM24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Fan Power Supply Fan Specifications Boxed 4-wire PWM/DTS Heatsink SolutionDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewThermal Solution Performance Characterics Thermal Profile AdherenceEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Overview Test PreparationHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Table C-1. Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Reference Heatsink Thermal Verification Environmental Reliability TestingStructural Reliability Testing Intel Verification Criteria for the Reference Designs2.2 Recommended Test Sequence Post-Test Pass CriteriaTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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