Intel 5400 Series manual Thermal Solution Performance Characterics, Thermal Profile Adherence

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1U Alternative Heatsink Thermal/Mechanical Design

A.2 Thermal Solution Performance Characterics

Figure A-2shows the performance of the 1U alternative heatsink. This figure shows the thermal performance and the pressure drop through fins of the heatsink versus the airflow provided. The best-fit equations for these curves are also provided to make it easier for users to determine the desired value without any error associated with reading the graph.

Figure A-2. 1U Alternative Heatsink Thermal Performance

Table A-1. 1U Alternative Heatsink Thermal Mechanical Characteristics

	Size	Height	Weight	Target Airflow	Mean Ψca	Standard	Pressure
		Height	Weight	Target Airflow		Standard	Drop
				Through Fins		Deviation Ψca	Drop
				Through Fins		Deviation Ψca

		(mm) [in.]	(kg) [lbs]	(m3/hr) [CFM]	(°C/W)	(°C/W)	(Pa) [in
							H2O]
	1U	27.00	0.24 [0.53]	25.5 [15]	0.305	0.0087	85 [0.34]
		[1.06]

A.3 Thermal Profile Adherence

The 1U alternative thermal solution is designed to meet the Thermal Profile for the Quad-Core Intel® Xeon® Processor E5400 Series in volumetrically constrained form factors. From Table A-1the three-sigma (mean+3sigma) performance of the thermal solution is computed to be 0.331 °C/W and the processor local ambient temperature (TLA) for this thermal solution is 40 °C. Hence, the Thermal Profile equation for this thermal solution is calculated as:

Equation A-1. y = 0.331*x + 40

where,

y = Processor TCASE value (°C)

54	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg Objective ScopeReferences Definition of Terms Terms and Descriptions Sheet 1Term Description Terms and Descriptions Sheet 2 TDPIntroduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Platform Environmental Control Interface Peci Multiple Core Special ConsiderationsMultiple Digital Thermal Sensor Operation Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Parameter Maximum Unit 2U+ CEK, Thermal Profile a1U CEK, Thermal Profile B Fan Fail Guidelines Sea-Level1U Alternative Heatsink Characterizing Cooling Solution Performance Requirements Fan Speed ControlEquation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WHeatsink Solutions Thermal/Mechanical Reference Design ConsiderationsHeatsink Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Fan Power Supply Fan Specifications Boxed 4-wire PWM/DTS Heatsink SolutionDescription Min Typ Max Unit Steady Startup Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkThermal Solution Performance Characterics Thermal Profile AdherenceEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Overview Test PreparationHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal Verification2.2 Recommended Test Sequence Post-Test Pass CriteriaTable E-1 Use Conditions Environment Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg