Intel 5400 Series manual Recommended Test Sequence, Post-Test Pass Criteria

Page 92

Quality and Reliability Requirements

Table E-1.	Use Conditions Environment

	Use Environment		Speculative Stress				Example Use		Example 7-Yr	Example 10-
			Speculative Stress				Example Use		Example 7-Yr	Yr Stress
			Condition					Condition	Stress Equiv.	Yr Stress
			Condition					Condition	Stress Equiv.	Equiv.
										Equiv.

	Shipping and	Mechanical Shock					Total of 12		n/a	n/a
	Handling	•	System-level				drops per
		•	Unpackaged				system:
		•	Unpackaged				•	2 drops per
		•	Trapezoidal				•	2 drops per
		•	Trapezoidal					axis
		•	25 g					axis
		•	25 g				•	± direction
		• velocity change is based					•	± direction
		• velocity change is based
			on packaged weight

		Product			Non-
		Weight (lbs)			palletized
					Product
					Velocity
					Change† (in/
					sec)
		< 20 lbs				250
		20 to > 40				225
		40 to > 80				205
		80 to < 100				175
		100 to <				145
		120				125
		≥120

		†Change in velocity is based
		upon a 0.5 coefficient of
		restitution.

	Shipping and	Random Vibration					Total per		n/a	n/a
	Handling	•	System Level				system:
		•	Unpackaged				•	10 minutes
		• 5 Hz to 500 Hz						per axis
		• 5 Hz to 500 Hz					•	3 axes
		• 2.20 g RMS random					•	3 axes
		• 2.20 g RMS random
		• 5 Hz @ .001 g2/Hz to
			20 Hz @ 0.01 g2/Hz
			(slope up)
		• 20 Hz to 500 Hz @ 0.01
			g2/Hz (flat)
		•	Random control limit
			tolerance is ± 3 dB

	Note: In the case of a discrepancy, information in the most recent LGA771 Socket Mechanical Design
	Guidelines supersedes that in the Table E-1above.
E.1.2.2	Recommended Test Sequence

Each test sequence should start with components (i.e. baseboard, heatsink assembly, etc.) that have not been previously submitted to any reliability testing.

The test sequence should always start with a visual inspection after assembly, and BIOS/Processor/memory test. The stress test should be then followed by a visual inspection and then BIOS/Processor/memory test.

E.1.2.3 Post-Test Pass Criteria

The post-test pass criteria are:

1.No significant physical damage to the heatsink and retention hardware.

2.Heatsink remains seated and its bottom remains mated flatly against the IHS surface. No visible gap between the heatsink base and processor IHS. No visible tilt of the heatsink with respect to the retention hardware.

92	Quad-Core Intel® Xeon® Processor 5400 Series TMDG

Image 92

Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 Terms and Descriptions Sheet 2 TDPIntroduction Mechanical Requirements Processor Mechanical ParametersProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Thermal Monitor for Multiple Core Products PROCHOT#, THERMTRIP#, and FORCEPR#Heatpipe Orientation for Multiple Core Processors Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Characterizing Cooling Solution Performance Requirements Fan Speed ControlProcessor Thermal Characterization Parameter Relationships Fan Speed Control, Tcontrol and DTS RelationshipEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAChassis Thermal Design Considerations Chassis Thermal Design Capabilities and ImprovementsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink CEK Heatsink Thermal Mechanical Characteristics Recommended Thermal Grease Dispense WeightThermal Interface Material TIM Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Test Procedure Examples Time-Zero, Room Temperature Preload MeasurementTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Environmental Reliability Testing Structural Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg