Thermal/Mechanical Reference Design
Figure 2-18. 1U CEK Heatsink Thermal Performance
2.5.6Thermal Profile Adherence
The 2U+ CEK Intel reference thermal solution is designed to meet the Thermal Profile A for the
Equation 2-8.y = 0.187*X + 40
where,
y = Processor TCASE value (°C) x = Processor power value (W)
Figure 2-19 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor 5400 Series Thermal Profile A specification. The 2U+ CEK solution meets the Thermal Profile A with a 0.6°C margin at the upper end (TDP). By designing to Thermal Profile A, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.
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