Intel 5400 Series manual 2U Heatsink Alternative CEK Copper Fin

Page 97

Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2)

Assembly

Component

Description

Development

Supplier Contact Info

Suppliers

 

 

 

 

 

 

 

 

 

2U Heatsink

Alternative CEK

Copper Fin,

Aavid

David Huang

 

Heatsink

Copper Base

Thermalloy

huang@aavid.com

 

 

 

CNDA#2525071

603-223-1724

 

 

 

 

 

 

 

 

Frank Hsue

 

 

 

 

frank.hsu@aavid.com.tw

 

 

 

 

886-2-26989888 x306

 

 

 

 

 

 

 

Copper Fin,

ADDA

Jungpin Chen

 

 

Copper Base

Corporation

jungpin@adda.com.tw

 

 

 

CNDA#AP1249

886-2-82212252x232

 

 

- and -

 

 

 

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

Asia Vital Components

Steve Huang (APAC)

 

 

Copper Base

(AVC)

+86-755-3366-8888 x66888

 

 

 

CNDA# AP5281

+86-138-252-45215

 

 

- and -

 

steve@avc.com.cn

 

 

 

 

 

 

Aluminum

 

Huabin Chen (China Only)

 

 

 

+886-755-3366-8888 x66871

 

 

 

 

 

 

 

 

huabin@avc.com.cn

 

 

 

 

 

 

 

Copper Fin,

Auras

Ian Shih

 

 

Copper Base

CNDA#5779699

liverpool@auras.com.tw

 

 

 

 

+886-937-183-194

 

 

- and -

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

CCI (Chaun-Choung

Monica Chih

 

 

Copper Base

Technology Co. Ltd.)

monica_chih@ccic.com.tw

 

 

 

CNDA#8747572

8862-29952666 EXT 292

 

 

- and -

 

Harry Lin

 

 

 

 

 

 

Aluminum

 

714-739-5797

 

 

 

ackinc@aol.com

 

 

 

 

 

 

 

 

 

 

 

Aluminum

CoolJag (Chia Cherne

Alice Yang

 

 

 

Industry Co., Ltd.)

+886-4-7323090

 

 

 

 

alice@cooljag.com

 

 

 

 

Kenny Kwang

 

 

 

 

510-824-0888

 

 

 

 

kenny@cooljagusa.com

 

 

 

 

 

 

 

Copper Fin,

CoolerMaster

Helena Wen

 

 

Copper Base

CNDA#7425225

helena_wen@collermaster.com.tw

 

 

 

 

+886-2-3234-0050x235

 

 

 

 

 

 

 

Copper Fin,

Taisol Electronics

Jane Yui

 

 

Copper Base

CNDA #3434254

jane.yui@taisol.com.tw

 

 

- and -

 

+886-2-2656-2658 x113

 

 

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

Thermaltake

Vera Lee

 

 

Copper Base

CNDA#7429482

vera@thermaltake.com

 

 

 

 

+886-2-2662-6501-255

 

 

 

 

 

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2Introduction Processor Mechanical Parameters Mechanical RequirementsProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation PROCHOT#, THERMTRIP#, and FORCEPR# Thermal Monitor for Multiple Core ProductsHeatpipe Orientation for Multiple Core Processors Processor Input Processor OutputFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance RequirementsFan Speed Control, Tcontrol and DTS Relationship Processor Thermal Characterization Parameter RelationshipsEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeEquation 2-4.ΨCA= ΨCS + ΨSA ExampleChassis Thermal Design Capabilities and Improvements Chassis Thermal Design ConsiderationsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Recommended Thermal Grease Dispense Weight CEK Heatsink Thermal Mechanical CharacteristicsThermal Interface Material TIM Processor Minimum Maximum Units24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Time-Zero, Room Temperature Preload Measurement Test Procedure ExamplesTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Structural Reliability Testing Environmental Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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