Intel 5400 Series manual 2U Heatsink Alternative CEK Copper Fin

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Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 1 of 2)

	Assembly	Component	Description	Development	Supplier Contact Info
	Assembly	Component	Description	Suppliers	Supplier Contact Info
				Suppliers

	2U Heatsink	Alternative CEK	Copper Fin,	Aavid	David Huang
		Heatsink	Copper Base	Thermalloy	huang@aavid.com
				CNDA#2525071	603-223-1724
				CNDA#2525071
					Frank Hsue
					frank.hsu@aavid.com.tw
					886-2-26989888 x306

			Copper Fin,	ADDA	Jungpin Chen
			Copper Base	Corporation	jungpin@adda.com.tw
				CNDA#AP1249	886-2-82212252x232
			- and -	CNDA#AP1249
			- and -
			Aluminum

			Copper Fin,	Asia Vital Components	Steve Huang (APAC)
			Copper Base	(AVC)	+86-755-3366-8888 x66888
				CNDA# AP5281	+86-138-252-45215
			- and -		steve@avc.com.cn
			- and -
			Aluminum		Huabin Chen (China Only)
			Aluminum		+886-755-3366-8888 x66871
					+886-755-3366-8888 x66871
					huabin@avc.com.cn

			Copper Fin,	Auras	Ian Shih
			Copper Base	CNDA#5779699	liverpool@auras.com.tw
					+886-937-183-194
			- and -
			Aluminum

			Copper Fin,	CCI (Chaun-Choung	Monica Chih
			Copper Base	Technology Co. Ltd.)	monica_chih@ccic.com.tw
				CNDA#8747572	8862-29952666 EXT 292
			- and -		Harry Lin
					Harry Lin
			Aluminum		714-739-5797
			Aluminum		ackinc@aol.com
					ackinc@aol.com

			Aluminum	CoolJag (Chia Cherne	Alice Yang
				Industry Co., Ltd.)	+886-4-7323090
					alice@cooljag.com
					Kenny Kwang
					510-824-0888
					kenny@cooljagusa.com

			Copper Fin,	CoolerMaster	Helena Wen
			Copper Base	CNDA#7425225	helena_wen@collermaster.com.tw
					+886-2-3234-0050x235

			Copper Fin,	Taisol Electronics	Jane Yui
			Copper Base	CNDA #3434254	jane.yui@taisol.com.tw
			- and -		+886-2-2656-2658 x113
			- and -
			Aluminum

			Copper Fin,	Thermaltake	Vera Lee
			Copper Base	CNDA#7429482	vera@thermaltake.com
					+886-2-2662-6501-255

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Thermal/Mechanical Design Guidelines Quad-Core Intel Xeon Processor 5400 SeriesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Initial release of the document Reference Revision Description Date NumberQuad-Core Intel Xeon Processor 5400 Series Tmdg Scope ObjectiveReferences Terms and Descriptions Sheet 1 Definition of TermsTerm Description TDP Terms and Descriptions Sheet 2Introduction Processor Mechanical Parameters Mechanical RequirementsProcessor Mechanical Parameters Table Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Thermal Control Circuit and TDP Processor Thermal Parameters and FeaturesDigital Thermal Sensor Multiple Core Special Considerations Platform Environmental Control Interface PeciMultiple Digital Thermal Sensor Operation PROCHOT#, THERMTRIP#, and FORCEPR# Thermal Monitor for Multiple Core ProductsHeatpipe Orientation for Multiple Core Processors Processor Input Processor OutputFeature Dimension Processor Core Geometric Center DimensionsEquation 2-1.y = ax + b Thermal ProfileEquation 2-2.TCONTROL= -TOFFSET Tcontrol DefinitionTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 2U+ CEK, Thermal Profile a Parameter Maximum Unit1U CEK, Thermal Profile B Sea-Level Fan Fail Guidelines1U Alternative Heatsink Fan Speed Control Characterizing Cooling Solution Performance RequirementsFan Speed Control, Tcontrol and DTS Relationship Processor Thermal Characterization Parameter RelationshipsEquation 2-3.ΨCA= Tcase TLA / TDP Condition FSC SchemeEquation 2-4.ΨCA= ΨCS + ΨSA ExampleChassis Thermal Design Capabilities and Improvements Chassis Thermal Design ConsiderationsEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WThermal/Mechanical Reference Design Considerations Heatsink SolutionsHeatsink Design Considerations Summary Thermal Interface MaterialGeometric Envelope Assembly DrawingStructural Considerations of CEK 17 U+ CEK Heatsink Thermal Performance Thermal Solution Performance CharacteristicsEquation 2-8.y = 0.187*X + Thermal Profile AdherenceEquation 2-9.y = 0.246*X + =0.187* X +40Equation 2-10.y = 0.246*X + 1UCEKReference SolutionHeatsink with Captive Screws and Standoffs Components Overview22. Isometric View of the 2U+ CEK Heatsink Recommended Thermal Grease Dispense Weight CEK Heatsink Thermal Mechanical CharacteristicsThermal Interface Material TIM Processor Minimum Maximum Units24. CEK Spring Isometric View CEK SpringThermal/Mechanical Reference Design Fan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Fan Power SupplyDescription Min Typ Max Unit Steady Startup Systems Considerations Associated with the Active CEK Boxed Processor ContentsThermal/Mechanical Reference Design Figure A-1. Isometric View of the 1U Alternative Heatsink Component OverviewThermal Profile Adherence Thermal Solution Performance CharactericsEquation A-1. y = 0.331*x + = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Drawing Description Table B-1. Mechanical Drawing ListFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Test Preparation OverviewHeatsink Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Time-Zero, Room Temperature Preload Measurement Test Procedure ExamplesTypical Test Equipment Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Structural Reliability Testing Environmental Reliability TestingIntel Verification Criteria for the Reference Designs Reference Heatsink Thermal VerificationPost-Test Pass Criteria 2.2 Recommended Test SequenceTable E-1 Use Conditions Environment Material and Recycling Requirements Recommended BIOS/Processor/Memory Test ProceduresQuality and Reliability Requirements Supplier Information Intel Enabled SuppliersFor 1U Additional Suppliers2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg