Intel 5400 Series manual Alternative CEK Copper Fin

Page 98

Enabled Suppliers Information

Table F-2. Additional Suppliers for the Quad-Core Intel® Xeon® Processor 5400 Series Intel Reference Solution (Sheet 2 of 2)

Assembly

Component

Description

Development

Supplier Contact Info

Suppliers

 

 

 

 

 

 

 

 

 

1U Heatsink

Alternative CEK

Copper Fin,

Aavid

David Huang

 

Heatsink

Copper Base

Thermalloy

huang@aavid.com

 

 

 

CNDA#2525071

603-223-1724

 

 

 

 

 

 

 

 

Frank Hsue

 

 

 

 

frank.hsu@aavid.com.tw

 

 

 

 

886-2-26989888 x306

 

 

 

 

 

 

 

Copper Fin,

ADDA

Jungpin Chen

 

 

Copper Base

CNDA# AP1249

jungpin@adda.com.tw

 

 

 

 

886-2-82212252-232

 

 

- and -

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

Asia Vital Components

Steve Huang (APAC)

 

 

Copper Base

(AVC)

+86-755-3366-8888 x66888

 

 

 

CNDA# AP5281

+86-138-252-45215

 

 

- and -

 

steve@avc.com.cn

 

 

 

 

 

 

Aluminum

 

Huabin Chen (China Only)

 

 

 

+886-755-3366-8888 x66871

 

 

 

 

huabin@avc.com.cn

 

 

 

 

 

 

 

Copper Fin,

Auras

Ian Shih

 

 

Copper Base

CNDA#5779699

liverpool@auras.com.tw

 

 

 

 

886-2-89901653 x314

 

 

- and -

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

CCI (Chaun-Choung

Monica Chih

 

 

Copper Base

Technology Co. Ltd.)

monica_chih@ccic.com.tw

 

 

 

CNDA# 8747572

886-2-29952666x292

 

 

- and -

 

Harry Lin

 

 

 

 

 

 

Aluminum

 

ackinc@aol.com

 

 

 

714-739-5797

 

 

 

 

 

 

 

 

 

 

 

Aluminum

CoolJag (Chia Cherne

Alice Yang

 

 

 

Industry Co., Ltd.)

+886-4-7323090

 

 

 

 

alice@cooljag.com

 

 

 

 

Kenny Kwang

 

 

 

 

510-824-0888

 

 

 

 

kenny@cooljagusa.com

 

 

 

 

 

 

 

Copper Fin,

CoolerMaster

Helena Wen

 

 

Copper Base

CNDA#7425225

helena_wen@collermaster.com.tw

 

 

 

 

+886-2-3234-0050x235

 

 

 

 

 

 

 

Copper Fin,

Molex

Aljo Amorelli

 

 

Copper Base

CNDA#11277

Aljo.Amorelli@molex.com

 

 

 

 

630-718-5919

 

 

- and -

 

Jeremy Shen

 

 

 

 

 

 

Aluminum

 

+886-2-26202300-459

 

 

 

+886-926132586

 

 

 

 

 

 

 

 

 

 

 

Copper Fin,

Taisol Electronics

Jane Yui

 

 

Copper Base

CNDA #3434254

jane.yui@taisol.com.tw

 

 

- and -

 

+886-2-2656-2658 x113

 

 

 

 

 

 

Aluminum

 

 

 

 

 

 

 

 

 

Copper Fin,

Thermaltake

Vera Lee

 

 

Copper Base

CNDA#7429482

vera@thermaltake.com

 

 

 

 

+886-2-2662-6501-255

 

 

- and -

 

 

 

 

Aluminum

 

 

 

 

 

 

 

98

 

 

Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 Terms and Descriptions Sheet 2 TDPIntroduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Characterizing Cooling Solution Performance Requirements Fan Speed ControlEquation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal VerificationTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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