Thermal/Mechanical Reference Design
Figure 2-20. 1U CEK Thermal Adherence to Quad-Core Intel® Xeon® Processor X5400 Series Thermal Profile B
| 70 | TCASE_MAX_B@ TDP |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |||
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
| 65 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 60 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| Thermal Profile B |
|
|
|
|
|
|
|
|
|
|
|
| |||
C) |
|
|
|
|
| Y= 0.221 * X+ 43.5 |
|
|
|
|
|
|
|
|
|
|
|
| |||
|
|
|
|
|
|
|
|
|
|
|
| 1UCEKReference Solution |
|
|
| ||||||
Temperature( | 55 |
|
|
|
|
|
|
|
|
|
|
|
|
|
| ||||||
|
|
|
|
|
|
|
|
|
|
|
|
|
| Y=0.246 * X+ 40 |
|
|
| ||||
50 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| |
| 45 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 40 |
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
|
| 120 |
| 0 | 5 | 10 | 15 | 20 | 25 | 30 | 35 | 40 | 45 | 50 | 55 | 60 | 65 | 70 | 75 | 80 | 90 | 100 | 110 | |
|
|
|
|
|
|
|
|
|
|
|
|
| Power (W) |
|
|
|
|
| TDP |
The 1U CEK Intel reference thermal solution is designed to meet the Thermal Profile specification for the
Equation 2-10.y = 0.246*X + 40
where,
y = Processor TCASE value (°C) x = Processor power value (W)
Figure 2-21 below shows the comparison of this reference thermal solution’s Thermal Profile to the Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile specification. The 1U CEK solution meets the Thermal Profile with 7.3°C margin at the upper end (TDP). By designing to Quad-Core Intel® Xeon® Processor E5400 Series Thermal Profile, it is ensured that no measurable performance loss due to TCC activation is observed under the given environmental conditions.
44 |
|