Intel 5400 Series Typical Test Equipment, Test Procedure Examples, Description Part Number Model

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Heatsink Clip Load Methodology

C.2.2 Typical Test Equipment

For the heatsink clip load measurement, use equivalent test equipment to the one listed Table C-1.

Table C-1. Typical Test Equipment

Item

Description

Part Number (Model)

 

 

 

Load cell

Honeywell*-Sensotec* Model 13 subminiature load cells,

AL322BL

Notes: 1, 5

compression only

 

 

Select a load range depending on load level being tested.

 

 

www.sensotec.com

 

 

 

 

Data Logger

Vishay* Measurements Group Model 6100 scanner with a

Model 6100

(or scanner)

6010A strain card (one card required per channel).

 

Notes: 2, 3, 4

 

 

 

 

 

Notes:

1.Select load range depending on expected load level. It is usually better, whenever possible, to operate in the high end of the load cell capability. Check with your load cell vendor for further information.

2.Since the load cells are calibrated in terms of mV/V, a data logger or scanner is required to supply 5 volts DC excitation and read the mV response. An automated model will take the sensitivity calibration of the load cells and convert the mV output into pounds.

3.With the test equipment listed above, it is possible to automate data recording and control with a 6101-PCI card (GPIB) added to the scanner, allowing it to be connected to a PC running LabVIEW* or Vishay's StrainSmart* software.

4.IMPORTANT: In addition to just a zeroing of the force reading at no applied load, it is important to calibrate the load cells against known loads. Load cells tend to drift. Contact your load cell vendor for calibration tools and procedure information.

5.When measuring loads under thermal stress (bake for example), load cell thermal capability must be checked, and the test setup must integrate any hardware used along with the load cell. For example, the Model 13 load cells are temperature compensated up to 71 °C, as long as the compensation package (spliced into the load cell's wiring) is also placed in the temperature chamber. The load cells can handle up to 121 °C (operating), but their uncertainty increases according to 0.02% rdg/°F.

C.2.3 Test Procedure Examples

The following sections give two examples of load measurement. However, this is not meant to be used in mechanical shock and vibration testing.

Any mechanical device used along with the heatsink attach mechanism will need to be included in the test setup (i.e., back plate, attach to chassis, etc.).

Prior to any test, make sure that the load cell has been calibrated against known loads, following load cell vendor’s instructions.

C.2.4 Time-Zero, Room Temperature Preload Measurement

1.Pre-assemble mechanical components on the board as needed prior to mounting the motherboard on an appropriate support fixture that replicate the board attach to a target chassis.

For example: If the attach mechanism includes fixtures on the back side of the board, those must be included, as the goal of the test is to measure the load provided by the actual heatsink mechanism.

2.Install the test vehicle in the socket.

3.Assemble the heatsink reworked with the load cells to motherboard as shown for the Quad-Core Intel® Xeon® Processor 5400 Series CEK-reference heatsink example in Figure C-3, and actuate attach mechanism.

4.Collect continuous load cell data at 1 Hz for the duration of the test. A minimum time to allow the load cell to settle is generally specified by the load cell vendors

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Quad-Core Intel® Xeon® Processor 5400 Series TMDG

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Contents Quad-Core Intel Xeon Processor 5400 Series Thermal/Mechanical Design GuidelinesQuad-Core Intel Xeon Processor 5400 Series Tmdg Contents Figures Preload Test Configuration Tables Reference Revision Description Date Number Initial release of the documentQuad-Core Intel Xeon Processor 5400 Series Tmdg References ObjectiveScope Term Description Definition of TermsTerms and Descriptions Sheet 1 Terms and Descriptions Sheet 2 TDPIntroduction Processor Mechanical Parameters Table Mechanical RequirementsProcessor Mechanical Parameters Parameter Minimum Maximum UnitQuad-Core Intel Xeon Processor 5400 Series Package Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design Quad-Core Intel Xeon Processor 5400 Series Considerations Processor Thermal Parameters and Features Thermal Control Circuit and TDPDigital Thermal Sensor Multiple Digital Thermal Sensor Operation Platform Environmental Control Interface PeciMultiple Core Special Considerations Heatpipe Orientation for Multiple Core Processors Thermal Monitor for Multiple Core ProductsPROCHOT#, THERMTRIP#, and FORCEPR# Processor Input Processor OutputProcessor Core Geometric Center Dimensions Feature DimensionThermal Profile Equation 2-1.y = ax + bTcontrol Definition Equation 2-2.TCONTROL= -TOFFSETTcontrol and Thermal Profile Interaction Thermal Profile B Performance Targets Thermal/Mechanical Reference Design Thermal/Mechanical Reference Design 1U CEK, Thermal Profile B Parameter Maximum Unit2U+ CEK, Thermal Profile a 1U Alternative Heatsink Fan Fail GuidelinesSea-Level Characterizing Cooling Solution Performance Requirements Fan Speed ControlEquation 2-3.ΨCA= Tcase TLA / TDP Processor Thermal Characterization Parameter RelationshipsFan Speed Control, Tcontrol and DTS Relationship Condition FSC SchemeExample Equation 2-4.ΨCA= ΨCS + ΨSAEquation 2-5.ΨCA= Tcase TLA / TDP = 68 45 / 85 = 0.27 C/W Chassis Thermal Design ConsiderationsChassis Thermal Design Capabilities and Improvements Equation 2-6.ΨSA= ΨCA − ΨCS = 0.27 − 0.05 = 0.22 C/WHeatsink Design Considerations Heatsink SolutionsThermal/Mechanical Reference Design Considerations Thermal Interface Material SummaryAssembly Drawing Geometric EnvelopeStructural Considerations of CEK Thermal Solution Performance Characteristics 17 U+ CEK Heatsink Thermal PerformanceThermal Profile Adherence Equation 2-8.y = 0.187*X +=0.187* X +40 Equation 2-9.y = 0.246*X +1UCEKReference Solution Equation 2-10.y = 0.246*X +Components Overview Heatsink with Captive Screws and Standoffs22. Isometric View of the 2U+ CEK Heatsink Thermal Interface Material TIM CEK Heatsink Thermal Mechanical CharacteristicsRecommended Thermal Grease Dispense Weight Processor Minimum Maximum UnitsCEK Spring 24. CEK Spring Isometric ViewThermal/Mechanical Reference Design Description Min Typ Max Unit Steady Startup Fan Power SupplyFan Specifications Boxed 4-wire PWM/DTS Heatsink Solution Boxed Processor Contents Systems Considerations Associated with the Active CEKThermal/Mechanical Reference Design Component Overview Figure A-1. Isometric View of the 1U Alternative HeatsinkEquation A-1. y = 0.331*x + Thermal Solution Performance CharactericsThermal Profile Adherence = Processor power value W 1U Alternative Heatsink Thermal/Mechanical Design Table B-1. Mechanical Drawing List Drawing DescriptionFigure B-1 2U CEK Heatsink Sheet 1 Figure B-2 2U CEK Heatsink Sheet 2 Figure B-3 U CEK Heatsink Sheet 3 Figure B-4 2U CEK Heatsink Sheet 4 Figure B-5. CEK Spring Sheet 1 Figure B-6. CEK Spring Sheet 2 Figure B-7. CEK Spring Sheet 3 Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Mechanical Drawings Figure B-14 U CEK Heatsink Sheet 1 Figure B-15 U CEK Heatsink Sheet 2 Figure B-16 U CEK Heatsink Sheet 3 Figure B-17 U CEK Heatsink Sheet 4 Figure B-18. Active CEK Thermal Solution Volumetric Sheet 1 Figure B-19. Active CEK Thermal Solution Volumetric Sheet 2 Figure B-20. Active CEK Thermal Solution Volumetric Sheet 3 Figure B-21 U Alternative Heatsink 1 Figure B-22 U Alternative Heatsink 2 Figure B-23 U Alternative Heatsink 3 Figure B-24 U Alternative Heatsink 4 Mechanical Drawings Heatsink Preparation OverviewTest Preparation Alternate Heatsink Sample Preparation Figure C-3. Preload Test Configuration Typical Test Equipment Test Procedure ExamplesTime-Zero, Room Temperature Preload Measurement Table C-1. Typical Test EquipmentPreload Degradation under Bake Conditions Heatsink Clip Load Methodology Safety Requirements Safety Requirements Intel Verification Criteria for the Reference Designs Environmental Reliability TestingStructural Reliability Testing Reference Heatsink Thermal VerificationTable E-1 Use Conditions Environment 2.2 Recommended Test SequencePost-Test Pass Criteria Recommended BIOS/Processor/Memory Test Procedures Material and Recycling RequirementsQuality and Reliability Requirements Intel Enabled Suppliers Supplier InformationAdditional Suppliers For 1U2U Heatsink Alternative CEK Copper Fin Alternative CEK Copper Fin Enabled Suppliers Information 100 Quad-Core Intel Xeon Processor 5400 Series Tmdg
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