Agilent Technologies FS2331 user manual Probing multiple DDR busses Interleaved memory

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Load the system config file “DR230_2” for 3 card state. This file will cause all three cards to be configured for state analysis operation. The card in slot C will be setup to capture DDR Commands at the CK0 rate. The full triggering capabilities of the analyzer are available if it is operating in “normal” mode (limit of 167Mhz for 16717 or 200Mhzfor 16750/1/2 cards). The cards in slot A and B (slot A is the master card) are configured to capture DDR Data transfers at 2x the CK0 rate. 1671X or 16750/1/2 cards are configured in “Turbo” mode which provides full speed state analysis with reduced triggering capability.

You are now ready to start making measurements. See the section “State Analysis Operation” for information on making state measurements.

Probing multiple DDR busses – Interleaved memory

Interleaved memory is defined here as a memory system that has multiple independent banks of memory in which the selection of the active bank is controlled by the memory address (typically the least significant bits). This allows one bank to initiate a new burst while the other bank is executing a burst. Each bank independently receives and processes its own set of DDR Commands.

The DDR probe supports analysis of interleaved memory by allowing you to plug a probe into a slot on each bank. Each probe is connected to independent logic analyzer “machines” using the instructions provided above. Because only two pods on the Command analyzer are used for each bus, you may share the Command analyzer with the second probe, using its two unused pods to independently trace the Command bus on the other memory bank. You still need additional cards to trace the data transfers for the second bank. Thus, to trace two banks of interleaved memory you need 5 cards configured into three separate modules; One card module split into two machines for the DDR Commands of each bank, and two separate two card modules for tracing the two banks DDR Data transfers. Refer to the table on page 17, and load the system config file for interleaved DDR Banks into all. The system config file will configure all five cards. The data burst capture modules are assumed to be in slots A(master) and B, and D(master) and E.

The command capture card is assumed to be in slot C, with pods C3 and C4 connected to the DDR bus whose data bus is probed by slots D/E, and pods C1 and C2 are connected to the DDR bus whose data bus is probed by slots A/B. Measurement on more than two banks are supported by replicating this strategy for the additional banks. Up to four banks can be analyzed by a single 16700 mainframe and expander. The following figure shows this setup:

DIMM Bank 0

DIMM Bank 1

Data

Command

Command

Data

16700 Slot A

16700 Slot B

C1/2 C3/4

16700 Slot D

16700 Slot E

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Contents Revision DDR Sdram Analysis Probe FS2331How to reach us Product Warranty Signal Connections For Sales and Marketing Support For Technical SupportLimitation of warranty Product WarrantyExclusive Remedies Logic Analyzer Modules Probe Cable, Connector NumberingIntroduction DefinitionsFS2331 100 pin Connector to Pod Diagram FS2331 Probe Description Probe Feature SummaryProbe Components DDR Data DDR CommandsProbe Design State Clock GenerationPage Pod Clock Domain Clock Rate Probe Pod AssignmentProbe Switch Settings Switch # Default factory Function PositionOn closed Connecting the Probe to the Logic Analyzer Logic Analyzer Signal Threshold Voltage SettingsConnecting Power to the FS2331 Probe Card Requirements for PC2700 Systems 16753/4/5/6 Logic Analyzer Card RequirementsRecommended 169xx Licensing Setting up the 167xx AnalyzerSetting up the 169xx Analyzer Software Requirements System SoftwareTiming Analysis All DDR speeds and supported analyzer cards Card Configurations for State Analysis Probing multiple DDR busses Interleaved memory If User is dedicating a Connecting to your Target System Chip Select§ Isolate the Dedicated DIMM’s pin Chip Select Jumper locations§ Sleeve the Pin Unused Pods § Wire from the adjacent Dimm slot to the isolated pinOffline Analysis Filtering Taking a Trace, Triggering, and Seeing Measurement Results Loading the Inverse Assembler and Decoding DDR CommandsTiming Analysis Operation State Analysis OperationInverse Assembler and Decoding DDR Commands Tracing the Serial Presence Detect Signals Using Eye Finder with the FS2331 DDR Probe Using EyeScan with the FS2331 Probe Dimm Signal Loading Option Using the FS2331 DDR Probe with an Interposer FS1024/25FS2331 Calibration Page Set Command sample position Page Page Write Burst Data Valid Position Page Page Page Read Burst Data Valid Position Page Page Page Set the final analyzer sample position Adjust the delay line value to maximize R/W overlapPage Standards supported General InformationSamtec Signal Connections J1 DataSA0 CB4 J2 Data and CommandSpare J3 Command and Data Buffcmdclk DM5DQS14 J4 DataDQS7