Repair/MaintenanceGuidelinesThis section provides guidelines for repa ir ing and maintaining the Agilent
E1445A AFG, including:
•ESD precautions
•Soldering printed circuit board s
•Post-repair safety checks
ESD
Precautions Electrostatic discharge (ESD) may damage static sensitive devices in the
Agilent E1445A AFG. This damage can range from slight parameter
degradation to catastrophic failure. When ha ndling AFG assemblies, follow
these guidelines to avoid damaging AFG components:
•Always use a static-free work station with a pad of conduct ive r ubber
or similar material when handling AFG components.
•If a device requires soldering, be s ure the assembly is placed on a
pad of conductive material. Also, be sure that you, the pad, and the
soldering iron tip are grounded to the as se mbl y.
Soldering Printed
Circuit Boards When soldering to any circuit board, keep in mind the following guidel ine s:
•Avoid unnecessary component unsoldering and soldering. Excessive
replacement can result in damage to the ci rcuit board and/or adjacent
components.
•Do not use a high power soldering iron on etched circuit boa rds, a s
excessive heat may lift a conductor or damage the boa r d.
•Use a suction device or wooden toothpick to rem ove solder from
component mounting holes. When usi ng a suction device, be sure
that the equipment is properly grounde d.
Post-Repair
Safety Checks After making repair s to the Agilent E1445A AF G, inspect the AFG for a ny
signs of abnormal internally generated he a t, suc h a s discolored printed
circuit boards or components, damaged insulation, or evidence of arcing.
Determine and correct the cause of the condition. Then perform the
Self-Test described in Chapter 2 to verify that the AFG is func t ional.