CHAPTER 4 Installation
4.1Notes on Drive Handling
4.2Connection Modes
4.3Settings
4.4Mounting
4.5Cable Connections
4.6Operation Confirmation and Preparation for Use after Installation
4.7Dismounting Drive
This chapter describes notes on handling the drives, connection modes, settings, mounting the drives, cable connections, and operation confirmation and preparation for use after installation, and notes on demounting the drives.
4.1 Notes on Drive Handling
(1) General notes
Note the following points to maintain drive performance and reliability:
1)Shock or vibration applied to the drive that exceeds the values defined in the standard damage the drive. Use care when unpacking.
2)Do not leave the drive in dirty or contaminated environments.
3)Since static discharge may destroy the CMOS devices in the drive, pay attention to the following points after unpacking:
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Use an antistatic mat and wrist strap when handling the drive.
Hold the mounting frame when handling the drive. Do not touch the PCA except when setting the switches.
4)When handling the drive, hold both sides of the mounting frame. When touching other than both sides of the mounting frame, avoid putting force.
5)Do not forcibly push up the end of the header pin of the printed circuit board unit when handling or setting the drive.
(2)Unpackaging
a)Make sure that the UP label on the package is pointing upward and start unpacking on a level surface. Handle the drive on a soft surface such as a rubber mat, not on a hard surface such as a desk.
