Intel 440GX Thermals / Cooling Solutions, Mechanicals, Design Considerations, Design Checklist

Design Checklist

3.19.2Design Considerations

•For UP systems to support both the current Intel® Pentium® II processor and future processors, it is highly recommended that storage space for two (or more) BIOS Updates be provided. This will allow manufacturing flexibility to install either processor, the BIOS should detect the processor and load the correct BIOS Update.

•For DP systems, it is recommended that storage for two (or more) BIOS Updates be reserved for the case where two different steppings of Slot 1 processors are installed. This will allow both processors to have BIOS Updates applied.

3.20Thermals / Cooling Solutions

•For the Intel® Pentium® II processor, an adequate heat sink and air ventilation must be

provided to ensure that the processor TPLATE specification documented in the datasheet is met. See the Intel® Pentium® II Processor Power Distribution Guidelines, and Intel® Pentium® II Processor Thermal Design Guidelines for thermal design information.

•For the Boxed processor, the system must have adequate air ventilation to ensure that the air intake temperature to the fan/heatsink is less than the maximum allowable fan preheat

temperature (TPH) at the system maximum ambient temperature, measured 0.3” above the center of the fan. See the Intel® Pentium® II Processor Datasheet for the TPH Specification.

•Verify that all major components, including the 82443GX can be cooled the way they are placed. Contact your local Intel Field Sales representative for the following Application Note: FW82443BX/FW82443GX PCI/AGP Controller Application Note #2: Thermal Design Considerations. This thermal application note contains thermal specifications, thermal solutions and the thermal test methodology for the 82443GX component.

3.20.1Design Considerations

•Could anything block the air flow to or from the processor card (I/O cards, VRM etc.)?

•Is there anything between the processor and the air intake that may preheat the air flowing into the fan/heatsink?

•If a system fan (other than the power supply fan) is used, have all recirculation paths been eliminated?

•What is the air flow through the PSU/system fan?

•What is the maximum ambient operation temperature of the system?

3.21Mechanicals

•For the Intel® Pentium® II processor: The physical space requirements of the processor must be met. See the Intel® Pentium® II Processor Datasheet for details.

•For the Intel® Pentium® II processor: The physical space requirements of your heat sink must be met.

•For the Boxed processor: The physical space requirements of the Boxed Intel® Pentium® II Processor processor fan/heatsink must be met. See the Intel® Pentium® II Processor Datasheet for details.

Intel®440GX AGPset Design Guide 3-36