Design Checklist

Following are general layout guidelines for using the Intel’s boot block flash memories (28F001GX/28F002BC) in the system:

•If adding a switch on VPP for write protection, switch to GND instead of VCC.

•Connect the DU pin of the 2Mbit devices to GND if anticipating to use the Intel SmartVoltage boot block flash memory family in the future.

•Use A16 inversion for 1Mbit devices and A17 inversion for 2Mbit devices to differentiate between recovery and normal modes. For systems needing a 1Mb to 2Mb upgrade path, A16 can be used for both devices alleviating the need for a board redesign.

•Use a 0.01mf - 0.1mf ceramic capacitor connected between each Vcc and GND, and between its Vpp and GND. These high frequency, inherently low inductance capacitors should be placed as close as possible to the package leads.

Figure 3-6illustrates the recommended layout for using Intel’s flash devices in desktop designs.

Figure 3-6. nterfacing Intel’s Flash with PIIX4E in Desktop

 

 

 

 

XD[7:0]

 

+ 1 2 V

 

 

 

L S 2 4 5

 

 

 

 

 

 

 

 

 

 

 

 

 

A

B

 

 

1

 

 

SD[7:0]

 

 

J1

 

 

 

 

 

 

 

V p p

2

 

V c c

 

 

 

 

1Mbit/2Mbit

+ 1 2 V

X D I R #

D I R

 

 

3

 

 

 

 

Flash

0.01uf

 

 

 

 

 

 

1

 

 

X O E #

G

 

 

 

R P #

J2

 

 

PIIX4E

 

 

 

 

2

 

 

 

 

 

 

 

 

 

 

 

1Mbit uses SA16

 

 

 

3

 

 

 

2Mbit uses SA17

1

 

 

0.01uf

 

 

 

 

 

V c c

 

 

 

 

 

J3

S A 1 6 /

 

 

 

S A 1 6 /

 

 

 

 

 

 

 

 

2

S A 1 7

V c c

 

 

 

S A 1 7

 

 

 

 

 

 

 

 

3

 

 

 

 

 

 

 

 

 

 

 

M E M W #

 

 

 

 

 

 

 

 

 

 

W E #

 

 

 

 

 

 

 

 

 

 

 

 

M E M R #

 

 

 

O E #

D U

 

 

 

B I O S C S #

 

 

 

C E #

 

 

 

 

 

J3

 

 

 

 

Mode

J1

J2

 

Mode

POS

 

 

 

 

 

Program

1-2

1-2

 

Recovery

 

1-2

 

 

 

 

 

 

PnP

1-2

2-3

 

Normal

 

2-3

 

 

 

 

 

 

Non-PnP

2-3

x

 

 

 

 

 

 

Simplified 2.7/3V/5V Design Considerations

Following are general layout guidelines for the Intel’s SmartVoltage/Smart 5 boot block flash memory (2/4Mbit BV/B5) in 3V or 5V designs:

•Connect 2.7V, 3V or 5V to VCC and connect 5V or 12V to VPP (program/erase levels) for BV devices.

•Connect 5V only to VCC and connect 5V or 12V to VPP (program/erase levels) for B5 devices.

•If adding a switch on VPP for write protection, switch to GND instead of VCC.

•Connect WP# to VCC, GND, or a general purpose output GPO[x] control signal. This pin should not be left floating. WP# pin replaces a DU pin and is used in conjunction with the VPP and RP# pins, as detailed in the table below, to control write protection of the boot block.

Intel®440GX AGPset Design Guide

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Intel 440GX manual XD70
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440GX specifications

The Intel 440GX chipset was launched in 1997 as part of Intel's series of chipsets known as the 440 family, and it served as a critical component for various Pentium II and Pentium III-based motherboard architectures. Specifically designed for the second generation of Intel’s processors, the 440GX delivered enhanced performance and supported a range of important technologies that defined PC architectures of its time.

One of the main features of the Intel 440GX was its support for a 100 MHz front-side bus (FSB), which significantly improved data transfer rates between the CPU and the memory subsystem. This advancement allowed the 440GX to accommodate both the original Pentium II processors as well as the later Pentium III chips, providing compatibility and flexibility for system builders and consumers alike.

The 440GX chipset included an integrated AGP (Accelerated Graphics Port) controller, which supported AGP 2x speeds. This enabled high-performance graphics cards to be utilized effectively, delivering many enhanced graphics capabilities for gaming and multimedia applications. The AGP interface was crucial at the time as it offered a dedicated pathway for graphics data, increasing bandwidth compared to traditional PCI slots.

In terms of memory support, the 440GX could address up to 512 MB of SDRAM, allowing systems built with this chipset to run comfortably with sufficient memory for the era’s demanding applications. The memory controller was capable of supporting both single and double-sided DIMMs, which provided versatility in memory configuration for system builders.

Another notable feature of the Intel 440GX was its support for multi-processor configurations through its Dual Processors support feature. This allowed enterprise and workstation computers to leverage the performance advantages of multiple CPUs, making the chipset suitable for business and professional environments where multitasking and high-performance computing were essential.

On the connectivity front, the chipset supported up to six PCI slots, enhancing peripheral device integration and expansion capabilities. It also included integrated IDE controllers, facilitating connections for hard drives and CD-ROM devices.

Overall, the Intel 440GX chipset represented a balanced combination of performance, flexibility, and technology advancements for its time. Its introduction helped establish a foundation for subsequent advancements in PC technology and set the stage for more powerful computing systems in the years to come.
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