Removal Procedure | Lincoln Electric SVM104-A specs

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F-42

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NOTE: It is recommended that when the Transistor Module is replaced, the Power Board and the Control Board should be replaced.

NOTE: See Figure F.15.

1.Disconnect input power to the machine.

2.Remove the Left Case Side assembly.

3.Perform the CAPACITOR DISCHARGE PROCEDURE.

4.Perform the POWER BOARD REMOVAL PROCEDURE.

6. Remove the Transistor Module
from the heat sink.
7. Install	the	replacement
Transistor Module.
a. Clean the heat sink surface
with “000 fine steel wool.
b. Rinse the heat sink surface
with alcohol or acetone.
c. Apply a .002” to .005” coat
of joint compound evenly to
the heat		sink	mounting
surface	and	the	Transistor
Module	mounting		surface.
Use	Lincoln			Joint
Compound		T12837,		or
equivalent,		such	as	Dow
Corning #340.
d. Press the Transistor Module
onto the heat sink surface.
Remove the module to make

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TRANSISTOR MODULE

SOCKET HEAD

CAP SCREWS

(TORQUE TO

26 IN/LBS (2.9 N/M))

sure enough joint compound
has	been	applied.		When
removed,		both	surfaces
should have an even texture
with no bare spots. If this
even-textured look does not
appear, re-apply the joint
compound.
e. Mount the Transistor Module
on the heat sink with the
5mm	socket		head	cap
screws to 26 in/lbs. Partially
tighten each cap screw one
at a time to avoid uneven
torque on the base plate.

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FIGURE F.15-Transistor Module loca-

5.Remove the two socket head cap screws from the Transistor Module using the 5mm Allen- Type wrench.