Electrical Specifications (Preliminary)

Thermal Power Dissipation

8.3Thermal Power Dissipation

 

 

 

 

 

 

Before designing a system, Marvell recommends reading application note AN-63:

 

 

 

 

 

 

 

 

 

 

 

 

Thermal Management for Marvell Technology Products. This application note presents

 

 

 

 

 

 

basic concepts of thermal management for integrated circuits (ICs) and includes

 

 

Note

 

 

guidelines to ensure optimal operating conditions for Marvell Technology's products.

 

 

 

 

 

 

 

 

 

 

 

 

 

 

The purpose of the Thermal Power Dissipation table is to support system engineering in thermal

 

design.

 

 

 

 

 

 

.

 

 

 

 

 

 

 

Table 37: Thermal Power Dissipation

 

 

 

 

 

 

 

 

 

 

 

Interface

 

Symbol

Test Conditions

Typ

Units

 

 

 

 

 

 

 

 

Core (VDD 1.0V)

 

PVDD

TCLK @ 200 MHz

280

mW

 

Embedded CPU (VDD_CPU 1.1V)

PVDD_CPU

CPU @ 1000 MHz,

790

mW

 

 

 

 

 

 

 

 

 

L2 @ 333 MHz

 

 

 

 

 

 

 

 

 

 

 

CPU @ 1200 MHz,

870

mW

 

 

 

 

 

 

 

 

 

L2 @ 400 MHz

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

 

CPU @ 1500 MHz,

1050

mW

 

 

 

 

 

 

 

 

 

L2 @ 500 MHz

 

 

 

 

 

 

 

 

 

 

RGMII 1.8V interface

 

PRGMII

 

30

mW

 

RGMII (10/100 RGMII only) 3.3V interface

PRGMII

 

50

mW

 

GMII 3.3V interface

 

PGMII

 

50

mW

 

MII/MMII 3.3V interface

 

PMII

 

10

mW

 

Miscellaneous interfaces

 

PMISC

 

50

mW

 

(JTAG, TWSI, UART, NAND flash, Audio,

 

 

 

 

 

SDIO, TDM, TS, and SPI)

 

 

 

 

 

 

 

 

 

 

 

 

DDR2 SDRAM interface (On-board,

PDDR2

Four on board devices, 75 ohm

250

mW

 

16-bit, 400 MHz)

 

 

ODT termination

 

 

 

eFuse during Burning mode

 

PFUSE

 

50

mW

 

NOTE: Since the eFuse burn is performed

 

 

 

 

 

only once, there is no thermal

 

 

 

 

 

effect after the burn has finished.

 

 

 

 

 

 

 

 

 

 

 

 

eFuse during Reading mode

 

PFUSE

 

25

mW

 

PCI Express interface

 

PPEX

 

100

mW

 

USB interface

 

PUSB

 

120

mW

 

SATA interface

 

PSATA

Both SATA ports

410

mW

 

Notes:

1.The values are for nominal voltage.

2.Power in mW is calculated using the typical recommended VDDIO specification for each power rail.

Copyright © 2008 Marvell

 

Doc. No. MV-S104859-U0 Rev. E

December 2, 2008, Preliminary

Document Classification: Proprietary Information

Page 79

Page 79
Image 79
Marvel Group 88F6281 specifications Thermal Power Dissipation