Thermal Data (Preliminary)

9 Thermal Data (Preliminary)

Table 72 provides the package thermal data for the device. This data is derived from simulations that were run according to the JEDEC standard.

The thermal parameters are preliminary and subject to change.

Note

TET

The documents listed below provide a basic understanding of thermal management of integrated circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell products. Before designing a system it is recommended to refer to these documents:

„Application Note, AN-63 Thermal Management for Selected Marvell® Products, Document Number MV-S300281-00

„White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Document Number MV-S700019-00.

Table 72: Thermal Data for the 88F6281 in the BGA 19 x 19 mm Package (Preliminary)

Symbol

Definition

Airflow Value (C/W)

 

 

 

0[m/s]

1[m/s]

2[m/s]

θJA

Thermal resistance: junction to ambient.

20.2

18.7

18.1

ΨJT

Thermal characterization parameter:

7.0

7.0

7.1

 

junction to case center.

 

 

 

θJC

Thermal resistance: junction to case (not air-flow dependent)

 

8.4

 

ΨJB

Thermal characterization parameter:

10.7

10.6

10.6

 

junction to the bottom of the package.

 

 

 

θJB

Thermal resistance:

 

10.9

 

 

junction to the bottom of the package (not air-flow dependent)

 

 

 

Copyright © 2008 Marvell

 

Doc. No. MV-S104859-U0 Rev. E

December 2, 2008, Preliminary

Document Classification: Proprietary Information

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Marvel Group 88F6281 specifications Thermal Data Preliminary, Symbol Definition Airflow Value C/W 0m/s 1m/s 2m/s