Thermal Data (Preliminary)

Copyright © 2008 Marvell Doc. No. MV-S104859-U0 Rev. E
December 2, 2008, Preliminary Document Classification: Proprietary Information Page 129
9Thermal Data (Preliminary)
Table 72 provides the package thermal data for the device. This data is derived from simulati ons that
were run according to the JEDEC standard.
The documents listed below provide a basic understanding of thermal management of integrated
circuits (ICs) and guidelines to ensure optimal operating conditions for Marvell products. Before
designing a system it is recommended to refer to these documents:
Application Note, AN-63 Thermal Management for Selected Marvell® Products, Document
Number MV-S300281-00
White Paper, ThetaJC, ThetaJA, and Temperature Calculations, Document Number
MV-S700019-00.
Note
TET
The thermal parameters are preliminary and subject to change.

Table 72: Thermal Data for the 88F6281 in the BGA 19 x 19 mm Package (Preliminary)

Symbol Definition Airflow Value (C/W)
0[m/s] 1[m/s] 2[m/s]
θJA Thermal resistance: junction to ambient. 20.2 18.7 18.1
ΨJT Thermal characterization parameter:
junction to case center. 7.0 7.0 7.1
θJC Thermal resistance: junction to case (not air-flow dependent) 8.4
ΨJB Thermal characterization parameter:
junction to the bottom of the package. 10.7 10.6 10.6
θJB Thermal resistance:
junction to the bottom of the package (not air-flow dependent) 10.9