Intel 317698-001 Ethernet Component Design Guidelines, Clock Source, Magnetics for 1000 BASE-T

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82575 Ethernet Controller Design Guide

3.0Ethernet Component Design Guidelines

These sections provide recommendations for selecting components and connecting special pins.

For 1000 BASE-T designs, the main design elements are the 82575 Gigabit Ethernet Controller, an integrated discrete or magnetics module with RJ-45 connector, an EEPROM, and a clock source.

3.1General Design Considerations for Ethernet Controllers

Follow good engineering practices with respect to unused inputs by terminating them with pull-up or pull-down resistors, unless the datasheet, design guide or reference schematic indicates otherwise. Do not attach pull-up or pull-down resistors to any balls identified as No Connect. These devices may have special test modes that could be entered unintentionally.

3.1.1Clock Source

All designs require a 25 MHz clock source. The 82575 Gigabit Ethernet Controller uses the 25 MHz source to generate clocks up to 125 MHz and 1.25 GHz for the PHY circuits, and 1.25 GHz for the SERDES. For optimum results with lowest cost, connect a 25 MHz parallel resonant crystal and appropriate load capacitors at the XTAL1 and XTAL2 leads. The frequency tolerance of the timing device should be 30 ppm or better. Refer to the application note, Intel Fast Ethernet Controllers Timing Device Selection Guide, AP-419, for more information on choosing crystals.

For further information regarding the clock for the 82575, see the sections about frequency control, crystals, and oscillators later in this document.

3.1.2Magnetics for 1000 BASE-T

Magnetics for the 82575 can be either integrated or discrete.

The magnetics module has a critical effect on overall IEEE and emissions conformance. The device should meet the performance required for a design with reasonable margin to allow for manufacturing variation. Occasionally, components that meet basic specifications may cause the system to fail IEEE testing because of interactions with other components or the printed circuit board itself. Carefully qualifying new magnetics modules prevents this problem.

When using discrete magnetics it is necessary to use Bob Smith termination: Use four 75 Ω resistors for cable-side center taps and unused pins. This method terminates pair- to-pair common mode impedance of the CAT5 cable.

Use an EFT capacitor attached to the termination plane. Suggested values are 1500 pF/ 2KV or 1000 pF/3KV. A minimum of 50-mil spacing from capacitor to traces and components should be maintained.

3.1.2.1Magnetics Module Qualification Steps

The steps involved in magnetics module qualification are similar to those for crystal qualification:

1.Verify that the vendor’s published specifications in the component datasheet meet or exceed the required IEEE specifications.

2.Independently measure the component’s electrical parameters on the test bench, checking samples from multiple lots. Check that the measured behavior is

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Contents Design Guide Intel 82575 Gigabit Ethernet ControllerPage Contents Design and Layout Checklists Date Revision Description Revision HistoryThis page intentionally left blank Scope IntroductionReference Documents Physical Layer Features Other PCI Express SignalsLink Width Configuration PCI Express Port Connection to the DeviceLane Reversal Polarity InversionLane Reversal supported modes PCI Express RoutingThis page left intentionally blank General Design Considerations for Ethernet Controllers Ethernet Component Design GuidelinesClock Source Magnetics for 1000 BASE-TModules for 1000 BASE-T Ethernet Designing with the 82575/EB/ES Gigabit Ethernet ControllerThird-Party Magnetics Manufacturers Manufacturer Part NumberPCI Function # Select PCI/LAN Function IndexFunction Default Control options Symbol Ball # Name and functionSerial Eeprom General RegionsSPI EEPROMs for 82575 Ethernet Controller Controller Eeprom Map InformationManufacturer Size Manufacturers Part Number Flash EeupdateFlash Erase Control Flash Write ControlFlash Device Information SMBus and NC-SIManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 Vout=1.0v 2A 1 82575 Ethernet Controller Power SequencingY Using Regulators With Enable Pins 2 82575 Ethernet Controller Device Power Supply FilteringPower Rail 7uF or 1uF 10uF PCIe Power Management Power ManagementL0s D0u D0a 4.2 82575 Ethernet Controller Power Management82575 Ethernet Controller Device Test Capability Auto Cross-over for MDI and MDI-X resolutionPHY Functionality Using SmartSpeed Low-Power Link UpSmartspeed Flow ControlPolarity Correction Link Energy Detect25.6 Reg Auto-Negotiation differences between PHY, SerDes and Sgmii Copper PHY Link ConfigurationSerDes-Detect Mode PHY is active Copper/Fiber SwitchInternal PHY-to-SerDes Transition Device DisableBios handling of Device Disable Software-Definable Pins SDPsEthernet Controller Design Guide Frequency Control Component Types Frequency Control Device Design ConsiderationsQuartz Crystal Fixed Crystal OscillatorCeramic Resonator Programmable Crystal OscillatorsTemperature Stability and Environmental Requirements Vibrational ModeCrystal Selection Parameters Nominal FrequencyLoad Capacitance Calibration ModeEquivalent Series Resistance Shunt CapacitanceDrive Level AgingReference Crystal Selection Temperature ChangesCircuit Board This page is intentionally left blank Specifications Symbol Parameter Units Min Typical Max Oscillator SolutionOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Ethernet Component Layout Guidelines Guidelines for Component PlacementLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystal layout considerations Crystals and OscillatorsCrystal Board Stack Up RecommendationsTrace Routing Differential Pair Trace Routing for 10/100/1000 DesignsSignal Termination and Coupling Signal Trace Geometry for 1000 BASE-T DesignsTrace Length and Symmetry for 1000 BASE-T Designs Signal Detect Signal IsolationRouting 1.8 V to the Magnetics Center Tap Impedance DiscontinuitiesTraces for Decoupling Capacitors Power and Ground PlanesTroubleshooting Common Physical Layout Issues Physical Layer Conformance TestingThermal Design Considerations Conformance Tests for 10/100/1000 Mbps DesignsEthernet Controller Design Guide Reference Schematics Design and Layout ChecklistsSymbol Thermal Management

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