Intel 317698-001 manual Routing 1.8 V to the Magnetics Center Tap, Impedance Discontinuities

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82575 Ethernet Controller Design Guide

7.1.6.1Signal Detect

Each port of the 82575 controller has a Signal Detect pin for connection to optical transceivers. For designs without optical transceivers, these signals can be left unconnected because they have internal pull-up resistors. Signal Detect is not a high- speed signal and does not require special layout.

7.1.7Routing 1.8 V to the Magnetics Center Tap

The central-tap 1.8 V should be delivered as a solid supply plane (1.8 V) directly to the magnetic module or, if this is not possible, by a short and thick trace (lower than 0.2ohm DC resistance). The decoupling capacitors for the central tap pins should be placed as close as possible to the magnetic component. This improves both EMI and IEEE compliance.

7.1.8Impedance Discontinuities

Impedance discontinuities cause unwanted signal reflections. Minimize vias (signal through holes) and other transmission line irregularities. If vias must be used, a reasonable budget is two per differential trace. Unused pads and stub traces should also be avoided.

7.1.9Reducing Circuit Inductance

Traces should be routed over a continuous reference plane with no interruptions. If there are vacant areas on a reference or power plane, the signal conductors should not cross the vacant area. This causes impedance mismatches and associated radiated noise levels. Noisy logic grounds should be separated from analog signal grounds to reduce coupling. Noisy logic grounds can sometimes affect sensitive DC subsystems such as analog to digital conversion, operational amplifiers, etc. All ground vias should be connected to every ground plane; and similarly, every power via, to all power planes at equal potential. This helps reduce circuit inductance. Another recommendation is to physically locate grounds to minimize the loop area between a signal path and its return path. Rise and fall times should be as slow as possible. Because signals with fast rise and fall times contain many high frequency harmonics, which can radiate significantly. The most sensitive signal returns closest to the chassis ground should be connected together. This will result in a smaller loop area and reduce the likelihood of crosstalk. The effect of different configurations on the amount of crosstalk can be studied using electronics modeling software.

7.1.10Signal Isolation

To maintain best signal integrity, keep digital signals far away from the analog traces. A good rule of thumb is no digital signal should be within 300 mils (7.5mm) of the differential pairs. If digital signals on other board layers cannot be separated by a ground plane, they should be routed perpendicular to the differential pairs. If there is another LAN controller on the board, take care to keep the differential pairs from that circuit away.

Some rules to follow for signal isolation:

Separate and group signals by function on separate layers if possible. If possible, maintain a gap of 100 mils between all differential pairs (Ethernet) and other nets, but group associated differential pairs together. Note: Over the length of the trace run, each differential pair should be at least 0.3 inches away from any parallel signal traces.

Physically group together all components associated with one clock trace to reduce trace length and radiation.

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Contents Intel 82575 Gigabit Ethernet Controller Design GuidePage Contents Design and Layout Checklists Revision History Date Revision DescriptionThis page intentionally left blank Introduction ScopeReference Documents Other PCI Express Signals Physical Layer FeaturesLink Width Configuration PCI Express Port Connection to the DevicePolarity Inversion Lane ReversalPCI Express Routing Lane Reversal supported modesThis page left intentionally blank Ethernet Component Design Guidelines General Design Considerations for Ethernet ControllersClock Source Magnetics for 1000 BASE-TDesigning with the 82575/EB/ES Gigabit Ethernet Controller Modules for 1000 BASE-T EthernetThird-Party Magnetics Manufacturers Manufacturer Part NumberPCI/LAN Function Index PCI Function # SelectSymbol Ball # Name and function Function Default Control optionsSerial Eeprom General RegionsSPI EEPROMs for 82575 Ethernet Controller Controller Eeprom Map InformationManufacturer Size Manufacturers Part Number Eeupdate FlashFlash Write Control Flash Erase ControlFlash Device Information SMBus and NC-SIManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 1 82575 Ethernet Controller Power Sequencing Vout=1.0v 2AY Using Regulators With Enable Pins 2 82575 Ethernet Controller Device Power Supply FilteringPower Rail 7uF or 1uF 10uF Power Management PCIe Power Management4.2 82575 Ethernet Controller Power Management L0s D0u D0a82575 Ethernet Controller Device Test Capability Auto Cross-over for MDI and MDI-X resolutionPHY Functionality Low-Power Link Up Using SmartSpeedSmartspeed Flow ControlPolarity Correction Link Energy Detect25.6 Reg Copper PHY Link Configuration Auto-Negotiation differences between PHY, SerDes and SgmiiCopper/Fiber Switch SerDes-Detect Mode PHY is activeDevice Disable Internal PHY-to-SerDes TransitionSoftware-Definable Pins SDPs Bios handling of Device DisableEthernet Controller Design Guide Frequency Control Device Design Considerations Frequency Control Component TypesQuartz Crystal Fixed Crystal OscillatorProgrammable Crystal Oscillators Ceramic ResonatorVibrational Mode Temperature Stability and Environmental RequirementsCrystal Selection Parameters Nominal FrequencyCalibration Mode Load CapacitanceShunt Capacitance Equivalent Series ResistanceDrive Level AgingReference Crystal Selection Temperature ChangesCircuit Board This page is intentionally left blank Specifications Symbol Parameter Units Min Typical Max Oscillator SolutionOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Ethernet Component Layout Guidelines Guidelines for Component PlacementLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystals and Oscillators Crystal layout considerationsBoard Stack Up Recommendations CrystalDifferential Pair Trace Routing for 10/100/1000 Designs Trace RoutingSignal Termination and Coupling Signal Trace Geometry for 1000 BASE-T DesignsTrace Length and Symmetry for 1000 BASE-T Designs Signal Isolation Signal DetectRouting 1.8 V to the Magnetics Center Tap Impedance DiscontinuitiesPower and Ground Planes Traces for Decoupling CapacitorsPhysical Layer Conformance Testing Troubleshooting Common Physical Layout IssuesThermal Design Considerations Conformance Tests for 10/100/1000 Mbps DesignsEthernet Controller Design Guide Design and Layout Checklists Reference SchematicsSymbol Thermal Management

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