Intel 317698-001 manual Lan

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82575 Ethernet Controller Design Guide

Minimizing the amount of space needed for the Ethernet LAN interface is important because other interfaces will compete for physical space on a motherboard near the connector. The Ethernet LAN circuits need to be as close as possible to the connector.

Keep silicon traces at least 1" from edge of

PB (2" is preferred).

Keep LAN silicon 1" - 4" from LAN connector.

Integrated

RJ-45

w/LAN

Magnetics

LAN

Silicon

Keep 50 mil minimum distance betewen TX and RX traces (100 mils is preferred).

NOTE: This figure represents a 10/100 diagram. Use the same design considerations for the two differential pairs not shown for gigabit implementations.

Figure 12. General Placement Distances for 1000 BASE-T Designs

Figure 5 shows some basic placement distance guidelines. The figure shows two differential pairs, but can be generalized for a Gigabit system with four analog pairs. The ideal placement for the Ethernet silicon would be approximately one inch behind the magnetics module.

While it is generally a good idea to minimize lengths and distances, this figure also illustrates the need to keep the LAN silicon away from the edge of the board and the magnetics module for best EMI performance.

The following figures illustrate a reference layout for discrete and integrated magnetics.

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Contents Intel 82575 Gigabit Ethernet Controller Design GuidePage Contents Design and Layout Checklists Revision History Date Revision DescriptionThis page intentionally left blank Introduction ScopeReference Documents Link Width Configuration Other PCI Express SignalsPhysical Layer Features PCI Express Port Connection to the DevicePolarity Inversion Lane ReversalPCI Express Routing Lane Reversal supported modesThis page left intentionally blank Clock Source Ethernet Component Design GuidelinesGeneral Design Considerations for Ethernet Controllers Magnetics for 1000 BASE-TThird-Party Magnetics Manufacturers Designing with the 82575/EB/ES Gigabit Ethernet ControllerModules for 1000 BASE-T Ethernet Manufacturer Part NumberPCI/LAN Function Index PCI Function # SelectSerial Eeprom Symbol Ball # Name and functionFunction Default Control options General RegionsSPI EEPROMs for 82575 Ethernet Controller Controller Eeprom Map InformationManufacturer Size Manufacturers Part Number Eeupdate FlashFlash Write Control Flash Erase ControlFlash Device Information SMBus and NC-SIManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 1 82575 Ethernet Controller Power Sequencing Vout=1.0v 2AY Using Regulators With Enable Pins 2 82575 Ethernet Controller Device Power Supply FilteringPower Rail 7uF or 1uF 10uF Power Management PCIe Power Management4.2 82575 Ethernet Controller Power Management L0s D0u D0a82575 Ethernet Controller Device Test Capability Auto Cross-over for MDI and MDI-X resolutionPHY Functionality Smartspeed Low-Power Link UpUsing SmartSpeed Flow ControlPolarity Correction Link Energy Detect25.6 Reg Copper PHY Link Configuration Auto-Negotiation differences between PHY, SerDes and SgmiiCopper/Fiber Switch SerDes-Detect Mode PHY is activeDevice Disable Internal PHY-to-SerDes TransitionSoftware-Definable Pins SDPs Bios handling of Device DisableEthernet Controller Design Guide Quartz Crystal Frequency Control Device Design ConsiderationsFrequency Control Component Types Fixed Crystal OscillatorProgrammable Crystal Oscillators Ceramic ResonatorCrystal Selection Parameters Vibrational ModeTemperature Stability and Environmental Requirements Nominal FrequencyCalibration Mode Load CapacitanceDrive Level Shunt CapacitanceEquivalent Series Resistance AgingReference Crystal Selection Temperature ChangesCircuit Board This page is intentionally left blank Specifications Symbol Parameter Units Min Typical Max Oscillator SolutionOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Ethernet Component Layout Guidelines Guidelines for Component PlacementLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystals and Oscillators Crystal layout considerationsBoard Stack Up Recommendations CrystalDifferential Pair Trace Routing for 10/100/1000 Designs Trace RoutingSignal Termination and Coupling Signal Trace Geometry for 1000 BASE-T DesignsTrace Length and Symmetry for 1000 BASE-T Designs Routing 1.8 V to the Magnetics Center Tap Signal IsolationSignal Detect Impedance DiscontinuitiesPower and Ground Planes Traces for Decoupling CapacitorsThermal Design Considerations Physical Layer Conformance TestingTroubleshooting Common Physical Layout Issues Conformance Tests for 10/100/1000 Mbps DesignsEthernet Controller Design Guide Symbol Design and Layout ChecklistsReference Schematics Thermal Management

317698-001 specifications

The Intel 317698-001 is a prominent and highly regarded component in the realm of computer hardware. This product is part of Intel's extensive portfolio, designed primarily for enhancing computing performance, efficiency, and reliability. It is typically associated with server motherboards and is known for its robust architecture, making it ideal for enterprise-level applications.

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