Intel 317698-001 manual Crystal Selection Parameters, Vibrational Mode, Nominal Frequency

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82575 Ethernet Controller Design Guide

5.0Crystal Selection Parameters

All crystals used with Intel Ethernet controllers are described as “AT-cut,” which refers to the angle at which the unit is sliced with respect to the long axis of the quartz stone. Table 4 lists crystals which have been used successfully in other designs (however, no particular product is recommended):

Table 7. Crystal Manufacturers and Part Numbers

Manufacturer

Part No.

 

 

RALTRON

AS-25.000-20-F-SMD-T

 

 

CITIZEN AMERICA CORP

HCM4925.000MBBKTR

 

 

NDK AMERICA INC

41CD25.0S11005020

 

 

TXC CORPORATION - USA

6C25000131

 

 

For information about crystal selection parameters, see the chart in the 82575 Ethernet Controller Advance Information Datasheet. Contact your Intel representative to obtain this document.

5.1Vibrational Mode

Crystals in the above-referenced frequency range are available in both fundamental and third overtone. Unless there is a special need for third overtone, use fundamental mode crystals.

At any given operating frequency, third overtone crystals are thicker and more rugged than fundamental mode crystals. Third overtone crystals are more suitable for use in military or harsh industrial environments. Third overtone crystals require a trap circuit (extra capacitor and inductor) in the load circuitry to suppress fundamental mode oscillation as the circuit powers up. Selecting values for these components is beyond the scope of this document.

5.2Nominal Frequency

Intel Ethernet controllers use a crystal frequency of 25.000 MHz. The 25 MHz input is used to generate a 125 MHz transmit clock for 100BASE-TX and 1000BASE-TX operation – 10 MHz and 20 MHz transmit clocks, for 10BASE-T operation.

5.3Frequency Tolerance

The frequency tolerance for an Ethernet Platform LAN Connect is dictated by the IEEE

802.3 specification as ±50 parts per million (ppm). This measurement is referenced to a standard temperature of 25° C. Intel recommends a frequency tolerance of ±30 ppm.

5.4Temperature Stability and Environmental Requirements

Temperature stability is a standard measure of how the oscillation frequency varies over the full operational temperature range (and beyond). Several optional temperature ranges are currently available, including -40° C to +85° C for industrial environments. Some vendors separate operating temperatures from temperature stability. Manufacturers may also list temperature stability as 50 ppm in their data sheets.

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Contents Intel 82575 Gigabit Ethernet Controller Design GuidePage Contents Design and Layout Checklists Revision History Date Revision DescriptionThis page intentionally left blank Introduction ScopeReference Documents Link Width Configuration Other PCI Express SignalsPhysical Layer Features PCI Express Port Connection to the DevicePolarity Inversion Lane ReversalPCI Express Routing Lane Reversal supported modesThis page left intentionally blank Clock Source Ethernet Component Design GuidelinesGeneral Design Considerations for Ethernet Controllers Magnetics for 1000 BASE-TThird-Party Magnetics Manufacturers Designing with the 82575/EB/ES Gigabit Ethernet ControllerModules for 1000 BASE-T Ethernet Manufacturer Part NumberPCI/LAN Function Index PCI Function # SelectSerial Eeprom Symbol Ball # Name and functionFunction Default Control options General RegionsManufacturer Size Manufacturers Part Number Eeprom Map InformationSPI EEPROMs for 82575 Ethernet Controller Controller Eeupdate FlashFlash Write Control Flash Erase ControlManufacturer Device SMBus and NC-SIFlash Device Information Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 1 82575 Ethernet Controller Power Sequencing Vout=1.0v 2AY Power Rail 7uF or 1uF 10uF 2 82575 Ethernet Controller Device Power Supply FilteringUsing Regulators With Enable Pins Power Management PCIe Power Management4.2 82575 Ethernet Controller Power Management L0s D0u D0aPHY Functionality Auto Cross-over for MDI and MDI-X resolution82575 Ethernet Controller Device Test Capability Smartspeed Low-Power Link UpUsing SmartSpeed Flow Control25.6 Reg Link Energy DetectPolarity Correction Copper PHY Link Configuration Auto-Negotiation differences between PHY, SerDes and SgmiiCopper/Fiber Switch SerDes-Detect Mode PHY is activeDevice Disable Internal PHY-to-SerDes TransitionSoftware-Definable Pins SDPs Bios handling of Device DisableEthernet Controller Design Guide Quartz Crystal Frequency Control Device Design ConsiderationsFrequency Control Component Types Fixed Crystal OscillatorProgrammable Crystal Oscillators Ceramic ResonatorCrystal Selection Parameters Vibrational ModeTemperature Stability and Environmental Requirements Nominal FrequencyCalibration Mode Load CapacitanceDrive Level Shunt CapacitanceEquivalent Series Resistance AgingCircuit Board Temperature ChangesReference Crystal Selection This page is intentionally left blank Oscillator Support Oscillator SolutionSpecifications Symbol Parameter Units Min Typical Max VGG=0.6V Rpar =100MΩ Cpar =20pF Layout Considerations for 82575 Ethernet Controllers Guidelines for Component PlacementEthernet Component Layout Guidelines LAN Layout for Integrated Magnetics Crystals and Oscillators Crystal layout considerationsBoard Stack Up Recommendations CrystalDifferential Pair Trace Routing for 10/100/1000 Designs Trace RoutingTrace Length and Symmetry for 1000 BASE-T Designs Signal Trace Geometry for 1000 BASE-T DesignsSignal Termination and Coupling Routing 1.8 V to the Magnetics Center Tap Signal IsolationSignal Detect Impedance DiscontinuitiesPower and Ground Planes Traces for Decoupling CapacitorsThermal Design Considerations Physical Layer Conformance TestingTroubleshooting Common Physical Layout Issues Conformance Tests for 10/100/1000 Mbps DesignsEthernet Controller Design Guide Symbol Design and Layout ChecklistsReference Schematics Thermal Management

317698-001 specifications

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