Intel 317698-001 manual Ethernet Controller Design Guide

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82575 Ethernet Controller Design Guide

where the traces enter or exit the magnetics, the RJ-45 connector, and the Ethernet silicon.

6.Use of a low-quality magnetics module.

7.Re-use of an out-of-date physical layer schematic in a Ethernet silicon design. The terminations and decoupling can be different from one PHY to another.

8.Incorrect differential trace impedances. It is important to have ~100 W impedance between the two traces within a differential pair. This becomes even more important as the differential traces become longer. To calculate differential impedance, many impedance calculators only multiply the single-ended impedance by two. This does not take into account edge-to-edge capacitive coupling between the two traces. When the two traces within a differential pair are kept close to each other, the edge coupling can lower the effective differential impedance by 5 W to 20 W. Short traces will have fewer problems if the differential impedance is slightly off target.

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Contents Design Guide Intel 82575 Gigabit Ethernet ControllerPage Contents Design and Layout Checklists Date Revision Description Revision HistoryThis page intentionally left blank Scope IntroductionReference Documents PCI Express Port Connection to the Device Other PCI Express SignalsPhysical Layer Features Link Width ConfigurationLane Reversal Polarity InversionLane Reversal supported modes PCI Express RoutingThis page left intentionally blank Magnetics for 1000 BASE-T Ethernet Component Design GuidelinesGeneral Design Considerations for Ethernet Controllers Clock SourceManufacturer Part Number Designing with the 82575/EB/ES Gigabit Ethernet ControllerModules for 1000 BASE-T Ethernet Third-Party Magnetics ManufacturersPCI Function # Select PCI/LAN Function IndexGeneral Regions Symbol Ball # Name and functionFunction Default Control options Serial EepromSPI EEPROMs for 82575 Ethernet Controller Controller Eeprom Map InformationManufacturer Size Manufacturers Part Number Flash EeupdateFlash Erase Control Flash Write ControlFlash Device Information SMBus and NC-SIManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 Vout=1.0v 2A 1 82575 Ethernet Controller Power SequencingY Using Regulators With Enable Pins 2 82575 Ethernet Controller Device Power Supply FilteringPower Rail 7uF or 1uF 10uF PCIe Power Management Power ManagementL0s D0u D0a 4.2 82575 Ethernet Controller Power Management82575 Ethernet Controller Device Test Capability Auto Cross-over for MDI and MDI-X resolutionPHY Functionality Flow Control Low-Power Link UpUsing SmartSpeed SmartspeedPolarity Correction Link Energy Detect25.6 Reg Auto-Negotiation differences between PHY, SerDes and Sgmii Copper PHY Link ConfigurationSerDes-Detect Mode PHY is active Copper/Fiber SwitchInternal PHY-to-SerDes Transition Device DisableBios handling of Device Disable Software-Definable Pins SDPsEthernet Controller Design Guide Fixed Crystal Oscillator Frequency Control Device Design ConsiderationsFrequency Control Component Types Quartz CrystalCeramic Resonator Programmable Crystal OscillatorsNominal Frequency Vibrational ModeTemperature Stability and Environmental Requirements Crystal Selection ParametersLoad Capacitance Calibration ModeAging Shunt CapacitanceEquivalent Series Resistance Drive LevelReference Crystal Selection Temperature ChangesCircuit Board This page is intentionally left blank Specifications Symbol Parameter Units Min Typical Max Oscillator SolutionOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Ethernet Component Layout Guidelines Guidelines for Component PlacementLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystal layout considerations Crystals and OscillatorsCrystal Board Stack Up RecommendationsTrace Routing Differential Pair Trace Routing for 10/100/1000 DesignsSignal Termination and Coupling Signal Trace Geometry for 1000 BASE-T DesignsTrace Length and Symmetry for 1000 BASE-T Designs Impedance Discontinuities Signal IsolationSignal Detect Routing 1.8 V to the Magnetics Center TapTraces for Decoupling Capacitors Power and Ground PlanesConformance Tests for 10/100/1000 Mbps Designs Physical Layer Conformance TestingTroubleshooting Common Physical Layout Issues Thermal Design ConsiderationsEthernet Controller Design Guide Thermal Management Design and Layout ChecklistsReference Schematics Symbol

317698-001 specifications

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