Intel 317698-001 manual Board Stack Up Recommendations, Crystal

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82575 Ethernet Controller Design Guide

Crystal Pad

Crystal

“B”

90 mils

90 mils

“B”

Capacitor

Capacitor

27pF

“A”

27pF

0402

 

0402

Less than 660 mils

“C”

Resistor 30-ohm 0402

Crystal Pad

Xtal2 Xtal1

Ethernet Controller

Figure 15. Recommended Crystal Placement and Layout

7.1.3Board Stack Up Recommendations

Printed circuit boards for these designs typically have six, eight, or more layers. Although, the 82575 does not dictate the stackup, here is an example of a typical six- layer board stackup:

•Layer 1 is a signal layer. It can contain the differential analog pairs from the Ethernet device to the magnetics module, or to an optical transceiver.

•Layer 2 is a signal ground layer. Chassis ground may also be fabricated in Layer 2 under the connector side of the magnetics module.

•Layer 3 is used for power planes.

•Layer 4 is a signal layer.

•Layer 5 is an additional ground layer.

•Layer 6 is a signal layer. For 1000 BASE-T (copper) Gigabit designs, it is common to route two of the differential pairs (per port) on this layer.

This board stack up configuration can be adjusted to conform to your company's design rules

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Contents Design Guide Intel 82575 Gigabit Ethernet ControllerPage Contents Design and Layout Checklists Date Revision Description Revision HistoryThis page intentionally left blank Scope IntroductionReference Documents Physical Layer Features Other PCI Express SignalsLink Width Configuration PCI Express Port Connection to the DeviceLane Reversal Polarity InversionLane Reversal supported modes PCI Express RoutingThis page left intentionally blank General Design Considerations for Ethernet Controllers Ethernet Component Design GuidelinesClock Source Magnetics for 1000 BASE-TModules for 1000 BASE-T Ethernet Designing with the 82575/EB/ES Gigabit Ethernet ControllerThird-Party Magnetics Manufacturers Manufacturer Part NumberPCI Function # Select PCI/LAN Function IndexFunction Default Control options Symbol Ball # Name and functionSerial Eeprom General RegionsSPI EEPROMs for 82575 Ethernet Controller Controller Eeprom Map InformationManufacturer Size Manufacturers Part Number Flash EeupdateFlash Erase Control Flash Write ControlFlash Device Information SMBus and NC-SIManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 Vout=1.0v 2A 1 82575 Ethernet Controller Power SequencingY Using Regulators With Enable Pins 2 82575 Ethernet Controller Device Power Supply FilteringPower Rail 7uF or 1uF 10uF PCIe Power Management Power ManagementL0s D0u D0a 4.2 82575 Ethernet Controller Power Management82575 Ethernet Controller Device Test Capability Auto Cross-over for MDI and MDI-X resolutionPHY Functionality Using SmartSpeed Low-Power Link UpSmartspeed Flow ControlPolarity Correction Link Energy Detect25.6 Reg Auto-Negotiation differences between PHY, SerDes and Sgmii Copper PHY Link ConfigurationSerDes-Detect Mode PHY is active Copper/Fiber SwitchInternal PHY-to-SerDes Transition Device DisableBios handling of Device Disable Software-Definable Pins SDPsEthernet Controller Design Guide Frequency Control Component Types Frequency Control Device Design ConsiderationsQuartz Crystal Fixed Crystal OscillatorCeramic Resonator Programmable Crystal OscillatorsTemperature Stability and Environmental Requirements Vibrational ModeCrystal Selection Parameters Nominal FrequencyLoad Capacitance Calibration ModeEquivalent Series Resistance Shunt CapacitanceDrive Level AgingReference Crystal Selection Temperature ChangesCircuit Board This page is intentionally left blank Specifications Symbol Parameter Units Min Typical Max Oscillator SolutionOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Ethernet Component Layout Guidelines Guidelines for Component PlacementLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystal layout considerations Crystals and OscillatorsCrystal Board Stack Up RecommendationsTrace Routing Differential Pair Trace Routing for 10/100/1000 DesignsSignal Termination and Coupling Signal Trace Geometry for 1000 BASE-T DesignsTrace Length and Symmetry for 1000 BASE-T Designs Signal Detect Signal IsolationRouting 1.8 V to the Magnetics Center Tap Impedance DiscontinuitiesTraces for Decoupling Capacitors Power and Ground PlanesTroubleshooting Common Physical Layout Issues Physical Layer Conformance TestingThermal Design Considerations Conformance Tests for 10/100/1000 Mbps DesignsEthernet Controller Design Guide Reference Schematics Design and Layout ChecklistsSymbol Thermal Management

317698-001 specifications

The Intel 317698-001 is a prominent and highly regarded component in the realm of computer hardware. This product is part of Intel's extensive portfolio, designed primarily for enhancing computing performance, efficiency, and reliability. It is typically associated with server motherboards and is known for its robust architecture, making it ideal for enterprise-level applications.

One of the standout features of the Intel 317698-001 is its compatibility with multiple Intel processors, which provides flexibility for users looking to upgrade or configure their systems. This compatibility ensures that enterprises can choose from a range of processors according to their specific workload requirements, allowing for tailored performance enhancements.

The product is built on the foundation of advanced technologies, such as Intel's Turbo Boost and Hyper-Threading. Turbo Boost allows the processor to operate at higher frequencies than its base clock speed when demand increases, providing a significant performance boost when needed. Hyper-Threading enables multiple threads to run simultaneously on each core, which can lead to improved multitasking capabilities and more efficient resource utilization.

Memory bandwidth is another vital characteristic of the Intel 317698-001. This component supports high-speed DDR4 memory, offering increased bandwidth that is crucial for data-intensive applications. The architecture is designed to work seamlessly with ECC (Error-Correcting Code) memory, enhancing system reliability by detecting and correcting internal data corruption.

In terms of connectivity, the Intel 317698-001 features multiple PCIe lanes, supporting various expansion cards for enhanced functionality. This includes the integration of NVMe drives for faster storage solutions, which is essential for modern applications that demand quick data access and retrieval.

Security is also a priority with the Intel 317698-001, which incorporates hardware-based security features to protect data integrity and prevent unauthorized access. These features include Intel Trusted Execution Technology, which creates a secure environment for executing sensitive code.

Overall, the Intel 317698-001 stands out with its combination of performance, versatility, and security. It is an ideal choice for businesses looking to enhance their computing capabilities while ensuring system reliability and security in an increasingly data-driven world. With its robust technological foundation, it continues to play a critical role in modern computing environments.
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