Intel 317698-001 Signal Trace Geometry for 1000 BASE-T Designs, Signal Termination and Coupling

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82575 Ethernet Controller Design Guide

7.1.4.1Signal Termination and Coupling

The four differential pairs of each port are terminated with 49.9 Ω (1% tolerance) resistors, placed near the 82575 controller. One resistor connects to the MDI+ signal trace and another resistor connects to the MDI- signal trace. The opposite ends of the resistors connect together and to ground through a single 0.1μF capacitor. The capacitor should be placed as close as possible to the 49.9 ohm resistors, using a wide trace. Stubs created by the 49.9 Ω (1% tolerance) termination resistors should be kept at a minimum.

Do not vary the suggested component values. Be sure to lay out symmetrical pads and traces for these components such that the length and symmetry of the differential pairs are not disturbed.

7.1.5Signal Trace Geometry for 1000 BASE-T Designs

The key factors in controlling trace EMI radiation are the trace length and the ratio of trace-width to trace-height above the reference plane. To minimize trace inductance, high-speed signals and signal layers that are close to a reference or power plane should be as short and wide as practical. Ideally, this trace width to height above the ground plane ratio is between 1:1 and 3:1. To maintain trace impedance, the width of the trace should be modified when changing from one board layer to another if the two layers are not equidistant from the neighboring planes.

Each pair of signal should have a differential impedance of 100 Ω. +/- 15%. If a particular tool cannot design differential traces, it is permissible to specify 55-65 Ω single-ended traces as long as the spacing between the two traces is minimized. As an example, consider a differential trace pair on Layer 1 that is 8 mils (0.2 mm) wide and 2 mils (0.05 mm) thick, with a spacing of 8 mils (0.2 mm). If the fiberglass layer is 8 mils (0.2mm) thick with a dielectric constant, ER, of 4.7, the calculated single-ended impedance would be approximately 61 Ω and the calculated differential impedance would be approximately 100 Ω.

When performing a board layout, do not allow the CAD tool auto-router to route the differential pairs without intervention. In most cases, the differential pairs will have to be routed manually.

Note: Measuring trace impedance for layout designs targeting 100 Ω often results in lower actual impedance. Designers should verify actual trace impedance and adjust the layout accordingly. If the actual impedance is consistently low, a target of 105 – 110 Ω should compensate for second order effects.

It is necessary to compensate for trace-to-trace edge coupling, which can lower the differential impedance by up to 10 Ω, when the traces within a pair are closer than 30 mils (edge to edge).

7.1.6Trace Length and Symmetry for 1000 BASE-T Designs

As indicated earlier, the overall length of differential pairs should be less than four inches measured from the Ethernet device to the magnetics.

The differential traces (within each pair) should be equal in total length to within 50 mils (1.25mm) and as symmetrical as possible. Asymmetrical and unequal length traces in the differential pairs contribute to common mode noise. If a choice has to be made between matching lengths and fixing symmetry, more emphasis should be placed on fixing symmetry. Common mode noise can degrade the receive circuit’s performance and contribute to radiated emissions.

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Contents Design Guide Intel 82575 Gigabit Ethernet ControllerPage Contents Design and Layout Checklists Date Revision Description Revision HistoryThis page intentionally left blank Scope IntroductionReference Documents PCI Express Port Connection to the Device Other PCI Express SignalsPhysical Layer Features Link Width ConfigurationLane Reversal Polarity InversionLane Reversal supported modes PCI Express RoutingThis page left intentionally blank Magnetics for 1000 BASE-T Ethernet Component Design GuidelinesGeneral Design Considerations for Ethernet Controllers Clock SourceManufacturer Part Number Designing with the 82575/EB/ES Gigabit Ethernet ControllerModules for 1000 BASE-T Ethernet Third-Party Magnetics ManufacturersPCI Function # Select PCI/LAN Function IndexGeneral Regions Symbol Ball # Name and functionFunction Default Control options Serial EepromEeprom Map Information SPI EEPROMs for 82575 Ethernet Controller ControllerManufacturer Size Manufacturers Part Number Flash EeupdateFlash Erase Control Flash Write ControlSMBus and NC-SI Flash Device InformationManufacturer Device Power Supplies for the 82575 Ethernet Controller Controllers Example Switching Voltage Regulator for 1.0 V and 1.8 Vout=1.0v 2A 1 82575 Ethernet Controller Power SequencingY 2 82575 Ethernet Controller Device Power Supply Filtering Using Regulators With Enable PinsPower Rail 7uF or 1uF 10uF PCIe Power Management Power ManagementL0s D0u D0a 4.2 82575 Ethernet Controller Power ManagementAuto Cross-over for MDI and MDI-X resolution 82575 Ethernet Controller Device Test CapabilityPHY Functionality Flow Control Low-Power Link UpUsing SmartSpeed SmartspeedLink Energy Detect Polarity Correction25.6 Reg Auto-Negotiation differences between PHY, SerDes and Sgmii Copper PHY Link ConfigurationSerDes-Detect Mode PHY is active Copper/Fiber SwitchInternal PHY-to-SerDes Transition Device DisableBios handling of Device Disable Software-Definable Pins SDPsEthernet Controller Design Guide Fixed Crystal Oscillator Frequency Control Device Design ConsiderationsFrequency Control Component Types Quartz CrystalCeramic Resonator Programmable Crystal OscillatorsNominal Frequency Vibrational ModeTemperature Stability and Environmental Requirements Crystal Selection ParametersLoad Capacitance Calibration ModeAging Shunt CapacitanceEquivalent Series Resistance Drive LevelTemperature Changes Reference Crystal SelectionCircuit Board This page is intentionally left blank Oscillator Solution Specifications Symbol Parameter Units Min Typical MaxOscillator Support VGG=0.6V Rpar =100MΩ Cpar =20pF Guidelines for Component Placement Ethernet Component Layout GuidelinesLayout Considerations for 82575 Ethernet Controllers LAN Layout for Integrated Magnetics Crystal layout considerations Crystals and OscillatorsCrystal Board Stack Up RecommendationsTrace Routing Differential Pair Trace Routing for 10/100/1000 DesignsSignal Trace Geometry for 1000 BASE-T Designs Signal Termination and CouplingTrace Length and Symmetry for 1000 BASE-T Designs Impedance Discontinuities Signal IsolationSignal Detect Routing 1.8 V to the Magnetics Center TapTraces for Decoupling Capacitors Power and Ground PlanesConformance Tests for 10/100/1000 Mbps Designs Physical Layer Conformance TestingTroubleshooting Common Physical Layout Issues Thermal Design ConsiderationsEthernet Controller Design Guide Thermal Management Design and Layout ChecklistsReference Schematics Symbol

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